KMI18/4,115 NXP Semiconductors, KMI18/4,115 Datasheet - Page 10

• Manufacturer Part Number: KMI18/4,115
• Manufacturer: NXP Semiconductors

Specifications of KMI18/4,115

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Philips Semiconductors
PACKAGE OUTLINE
2000 Sep 05
Plastic single-ended multi-chip package;
magnetized ferrite magnet (5.5 x 5.5 x 3 mm); 4 interconnections; 3 in-line leads
Integrated rotational speed sensor
DIMENSIONS (mm are the original dimensions)
Notes
1. Glue thickness not included.
2. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
3. Magnet chamber optional.
UNIT
mm
OUTLINE
VERSION
SOT477C
A
1.7
1.4
(1)
0.8
0.7
b p
b p1
1.57
1.47
b p1
L 1
0.24
0.3
c
IEC
1
D
4.1
3.9
e 1
(2)
H E1
M 1
D 1
E
e
5.7
5.5
(2)
2
b p
E
4.5
4.3
(2)
JEDEC
E 1
5.7
5.5
3
(2)
REFERENCES
E 1
B
L 2
4.6
4.4
e
D
v
D 1
M
2.35
2.15
L
e 1
B
A
EIAJ
18.2
17.8
10
H E
0
SENSOR DIE POSITION
*
centre of reading point
H E1
v
5.6
5.5
M
scale
2.5
A B
max.
3.87
K
M 2
7.55
7.25
(3)
L
M 4
5 mm
1.2
0.9
L 1
3.9
3.5
L 2
M 3
K
PROJECTION
EUROPEAN
5.65
5.35
M 1
c
5.65
5.35
A
M 2
Q
Objective specification
M 3
3.05
2.95
H E
(1)
M 4
2.6
2.4
ISSUE DATE
KMI18/4
00-08-31
0.75
0.65
Q
SOT477C
0.25
v