MT48H16M16LFBF-8:G Micron Technology Inc, MT48H16M16LFBF-8:G Datasheet - Page 14

MT48H16M16LFBF-8:G

Manufacturer Part Number
MT48H16M16LFBF-8:G
Description
Manufacturer
Micron Technology Inc
Type
Mobile SDRAMr
Datasheet

Specifications of MT48H16M16LFBF-8:G

Organization
16Mx16
Density
256Mb
Address Bus
15b
Access Time (max)
9/7ns
Maximum Clock Rate
125MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.95V
Operating Supply Voltage (min)
1.7V
Supply Current
85mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Compliant
Figure 6: 90-Ball VFBGA (8mm x 13mm)
PDF: 09005aef834c13d2
256mb_mobile_sdram_y36n.pdf - Rev. I 11/09 EN
Solder ball
material: SAC105.
Dimensions apply to
solder balls post-
reflow on Ø0.4
SMD ball pads.
90X Ø0.45
Seating
11.2 CTR
plane
0.1 A
0.8 TYP
Note:
A
9
8
1. All dimensions are in millimeters.
7
0.8 TYP
6.4 CTR
8 ±0.1
Ball A1 ID
3
2
256Mb: 16 Meg x 16, 8 Meg x 32 Mobile SDRAM
1
0.65 ±0.05
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
14
13 ±0.1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
0.25 MIN
1.0 MAX
Package Dimensions
©2008 Micron Technology, Inc. All rights reserved.
Ball A1 ID

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