SI5338M-A-GMR Silicon Laboratories Inc, SI5338M-A-GMR Datasheet - Page 167

• Manufacturer Part Number: SI5338M-A-GMR
• Manufacturer: Silicon Laboratories Inc

10. Recommended PCB Layout
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. Center pad should be connected to the nearest GND plane.
5. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is
6. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder
7. The stencil thickness should be 0.125 mm (5 mils).
8. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
9. A 2x2 array of 1.0 mm square openings on 1.25 mm pitch should be used for the center ground pad.
10. A No-Clean, Type-3 solder paste is recommended.
11. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body Components.
to be 60 µm minimum, all the way around the pad.
paste release.
Dimension
P1
P2
X1
Y1
C1
C2
E
Table 20. PCB Land Pattern
2.50
2.50
0.20
0.75
Min
Rev. 0.6
3.90
3.90
0.50
Nom
2.55
2.55
0.25
0.80
Max
2.60
2.60
0.30
0.85
Si5338
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