XC3S1200E-4FGG320I Xilinx Inc, XC3S1200E-4FGG320I Datasheet - Page 189

• Manufacturer Part Number: XC3S1200E-4FGG320I
• Description: IC FPGA SPARTAN-3E 1200K 320FBGA
• Manufacturer: Xilinx Inc
• Series: Spartan™-3Er

Specifications of XC3S1200E-4FGG320I

• Number Of Logic Elements/cells: 19512
• Number Of Labs/clbs: 2168
• Total Ram Bits: 516096
• Number Of I /o: 250
• Number Of Gates: 1200000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 320-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

User I/Os by Bank
Table 142
distributed between the four I/O banks on the PQ208 pack-
age.
Table 142: User I/Os Per Bank for the XC3S250E and XC3S500E in the PQ208 Package
DS312-4 (v3.8) August 26, 2009
Product Specification
Notes:
1.
2.
Top
Right
Bottom
Left
TOTAL
Package
Some VREF and CLK pins are on INPUT pins.
The eight global clock pins in this bank have optional functionality during configuration and are counted in the DUAL column.
Edge
indicates how the 158 available user-I/O pins are
R
I/O Bank
0
1
2
3
Maximum
158
I/O
38
40
40
40
I/O
18
23
58
9
8
www.xilinx.com
Footprint Migration Differences
The XC3S250E and XC3S500E FPGAs have identical foot-
prints in the PQ208 package. Designs can migrate between
the XC3S250E and XC3S500E without further consider-
ation.
INPUT
25
6
7
6
6
All Possible I/O Pins by Type
DUAL
21
24
46
1
0
VREF
13
5
3
2
3
Pinout Descriptions
(1)
CLK
0
0
16
8
8
(2)
(2)
(1)
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