XCV812E-6BG560C Xilinx Inc, XCV812E-6BG560C Datasheet - Page 106

• Manufacturer Part Number: XCV812E-6BG560C
• Description: IC FPGA 1.8V C-TEMP 560-MBGA
• Manufacturer: Xilinx Inc
• Series: Virtex™-E EMr

Specifications of XCV812E-6BG560C

• Number Of Logic Elements/cells: 21168
• Number Of Labs/clbs: 4704
• Total Ram Bits: 1146880
• Number Of I /o: 404
• Number Of Gates: 254016
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 560-LBGA, Metal
• Dc: 0325
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Virtex™-E 1.8 V Extended Memory Field Programmable Gate Arrays
Table 5:
Module 4 of 4
30
Bank
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
FG900 Fine-Pitch BGA Package — XCV812E
IO_VREF_L131N_YY
IO_VREF_L135N_Y
IO_INIT_L141N_YY
IO_D7_L141P_YY
IO_L131P_YY
IO_L134P_YY
IO_L134N_YY
IO_L142P_YY
IO_L139N_Y
IO_L135P_Y
IO_L139P_Y
Description
IO_VREF_4
IO_L132N
IO_L133N
IO_L136N
IO_L138N
IO_L132P
IO_L133P
IO_L136P
IO_L138P
GCK0
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
AG29
AC27
AD28
AB25
AC26
AE30
AD27
AF30
AF29
AB24
AB23
AE28
AE26
AH30
AC24
AH29
AA22
AB19
AC16
AC19
AD19
AD20
AE21
AF19
AH17
AH23
AH26
AH27
AK18
AA18
AF27
AJ16
Y22
Pin
www.xilinx.com
1-800-255-7778
Table 5:
Bank
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
FG900 Fine-Pitch BGA Package — XCV812E
IO_VREF_4_L148P_YY
IO_VREF_4_L152P_YY
IO_VREF_4_L156P_YY
IO_L142N_YY
IO_L147N_YY
IO_L148N_YY
IO_L151N_YY
IO_L152N_YY
IO_L155N_YY
IO_L156N_YY
IO_L147P_YY
IO_L151P_YY
IO_L155P_YY
IO_L165P_YY
IO_L144N_Y
IO_L145N_Y
IO_L162N_Y
IO_L163N_Y
IO_L144P_Y
IO_L145P_Y
IO_L162P_Y
IO_L163P_Y
Description
IO_L149N
IO_L150N
IO_L153N
IO_L154N
IO_L158N
IO_L160N
IO_L149P
IO_L150P
IO_L153P
IO_L154P
IO_L158P
IO_L160P
DS025-4 (v1.6) July 17, 2002
AG25
AK28
AD23
AB21
AA21
AD22
AA20
AH25
AC21
AG24
AK26
AE23
AB20
AC20
AG23
AE22
AG22
AA19
AG21
AK23
AE20
AG20
AF25
AF24
AF23
AF22
AF21
AF20
AJ27
AJ26
AJ24
AJ22
AJ21
AJ20
Pin
R