XCV812E-6BG560C Xilinx Inc, XCV812E-6BG560C Datasheet - Page 110

• Manufacturer Part Number: XCV812E-6BG560C
• Description: IC FPGA 1.8V C-TEMP 560-MBGA
• Manufacturer: Xilinx Inc
• Series: Virtex™-E EMr

Specifications of XCV812E-6BG560C

• Number Of Logic Elements/cells: 21168
• Number Of Labs/clbs: 4704
• Total Ram Bits: 1146880
• Number Of I /o: 404
• Number Of Gates: 254016
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 560-LBGA, Metal
• Dc: 0325
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Virtex™-E 1.8 V Extended Memory Field Programmable Gate Arrays
Table 5:
Module 4 of 4
34
Bank
NA
NA
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
2
3
FG900 Fine-Pitch BGA Package — XCV812E
IO_VREF_L266P_YY
IO_VREF_L273P_YY
IO_VREF_L277P_Y
IO_VREF_L269P
IO_L272N_YY
IO_L272P_YY
IO_L273N_YY
IO_L276N_YY
IO_L276P_YY
IO_L271N_Y
IO_L277N_Y
IO_L281N_Y
IO_L271P_Y
IO_L281P_Y
Description
IO_L267N
IO_L268N
IO_L269N
IO_L270N
IO_L274N
IO_L275N
IO_L278N
IO_L280N
IO_L267P
IO_L268P
IO_L270P
IO_L274P
IO_L275P
IO_L278P
IO_L280P
DONE
CCLK
DXN
DXP
AJ28
AH4
AJ3
F26
Pin
H4
H1
H5
G2
G5
G3
H6
G6
C2
D2
K3
K4
K6
K7
F3
K8
E1
E2
E4
K9
F4
F5
L7
L8
J5
J7
J2
L9
J8
www.xilinx.com
1-800-255-7778
Table 5:
Bank
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
2
FG900 Fine-Pitch BGA Package — XCV812E
Description
PROGRAM
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
VCCINT
TDO
TMS
TCK
TDI
M0
M1
M2
DS025-4 (v1.6) July 17, 2002
AG28
AC7
M11
M12
M19
M20
AF4
AK3
H22
D26
N13
N14
N15
N16
N17
N18
P13
P18
R13
R18
U18
U13
V13
V14
V15
T13
T18
Pin
L11
L12
L19
L20
B3
C1
R