92250-588 FCI, 92250-588 Datasheet - Page 3

• Manufacturer Part Number: 92250-588
• Description: Telecom & Ethernet Connectors LOW PRO PCB 8 POS
• Manufacturer: FCI

Specifications of 92250-588

• Product: Telecom & Ethernet Connectors
• Usoc Codes: RJ45
• Number Of Ports: 1
• Shielding: Shielded
• Current Rating: 1 A
• Voltage Rating: 1000 V
• Housing Material: Nylon
• Color: Black
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

7.
8.
9.
10.
11.
TITLE
Copyright FCI
Form E-3334
Rev E
6.9.
7.1.
7.2.
7.3.
7.4.
7.5.
8.1.
8.2.
8.3.
8.4.
8.5.
8.6.
8.7.
8.8.
9.1.
9.2.
9.3.
9.4.
9.5.
9.6.
6.8.1.
6.8.2.
6.8.3.
6.8.4.
7.3.1.
7.3.2.
7.3.3.
7.4.1.
7.4.2.
MECHANICAL CHARACTERISTICS .....................................................................................................19
ENVIRONMENTAL CONDITIONS..........................................................................................................21
QUALITY ASSURANCE PROVISIONS..................................................................................................22
NOTES AND DEFINITIONS....................................................................................................................25
REFERENCE DOCUMENTS ..................................................................................................................25
Current Rating and Current Carrying Capacity ...............................................................................19
Mating and Unmating Forces...........................................................................................................19
The Spring Form and Shield Tabs...................................................................................................19
Retention..........................................................................................................................................20
Vibration and Mechanical Shock .....................................................................................................20
Six position plug stress test .............................................................................................................20
Thermal Shock - EIA 364-32 (Tested Unmated) .............................................................................21
Humidity, Steady State - EIA 364-31, Method II..............................................................................21
High Temperature Life - EIA 364-17................................................................................................21
Hydrogen Sulfide (H2S) - BUS-03-302 (Mated) ..............................................................................21
Resistance to Solvents. ...................................................................................................................21
Durability. .........................................................................................................................................21
Solderability .....................................................................................................................................22
Resistance to Soldering Heat. .........................................................................................................22
Equipment Calibration. ....................................................................................................................22
Inspection Conditions. .....................................................................................................................22
Sample Quantify and Description. ...................................................................................................23
Acceptance ......................................................................................................................................23
Qualification Testing ........................................................................................................................23
Requalification Testing ....................................................................................................................23
Attenuation (Insertion Loss) .........................................................................................................17
NEXT Loss ...................................................................................................................................17
Return Loss ..................................................................................................................................18
DC Resistance. ............................................................................................................................18
Effectiveness of connector coupling device.................................................................................20
Overall Assembly After Soldering. ...............................................................................................20
Jack to Board. ..............................................................................................................................20
Vibration .......................................................................................................................................20
Mechanical Shock ........................................................................................................................20
Single and Multi-Port Jack Assemblies
TYPE
PRODUCT SPECIFICATION
PDM: Rev:J
STATUS:
NUMBER
PAGE
AUTHORIZED BY
STATUS
J.R. VOLSTORF
Released
3 of 26
UNRESTRICTED
GS-12-083
Printed: Dec 09, 2008
REVISION
DATE
7-Jun-06
J
GS-01-001
.