CY8C20336-24LQXI Cypress Semiconductor Corp, CY8C20336-24LQXI Datasheet - Page 10
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CY8C20336-24LQXI
Manufacturer Part Number
CY8C20336-24LQXI
Description
IC CAPSENSE 20 I/O 8K 24UQFN
Manufacturer
Cypress Semiconductor Corp
Series
CapSense® Controllersr
Datasheet
1.CY8C20236-24LKXI.pdf
(39 pages)
Specifications of CY8C20336-24LQXI
Applications
Capacitive Sensing
Core Processor
M8C
Program Memory Type
FLASH (8 kB)
Controller Series
CY8C20xx6
Ram Size
1K x 8
Interface
I²C, SPI
Number Of I /o
20
Voltage - Supply
1.71 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
24-UQFN Exposed Pad, 24-HUQFN
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Technology
CMOS
Processing Unit
Microprocessor
Operating Supply Voltage (min)
1.71V
Operating Supply Voltage (typ)
1.8/2.5/3.3/5V
Operating Supply Voltage (max)
5.5V
Package Type
QFN EP
Screening Level
Industrial
Pin Count
24
Mounting
Surface Mount
Rad Hardened
No
Processor Series
CY8C20x36
Core
M8C
Data Bus Width
8 bit
Mounting Style
SMD/SMT
Development Tools By Supplier
CY3280-20X66
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
770-1000 - ISP 4PORT FOR CYPRESS PSOC MCU
Lead Free Status / Rohs Status
Details
Other names
428-2942
24-Pin QFN with USB
Table 4. Pin Definitions - CY8C20396 PSoC Device
Document Number: 001-12696 Rev. *E
LEGEND I = Input, O = Output, OH = 5 mA High Output Drive, R = Regulated Output
Pin No.
CP
10
12
13
14
15
16
17
18
19
20
21
22
23
24
11
1
2
3
4
5
6
7
8
9
Digital
RESET INPUT
IOHR
IOHR
IOHR
IOHR
IOHR
IOHR
IOHR
IOHR
IOH
IOH
IOH
IOH
IOH
IOH
IOH
IOH
I/O
I/O
I/O
I/O
I/O
Power
Power
Power
Type
Analog
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
Name
XRES
P2[5]
P2[3]
P2[1]
P1[7]
P1[5]
P1[3]
P1[1]
P1[0]
P1[2]
P1[4]
P1[6]
P0[0]
P0[2]
P0[4]
P0[6]
P0[7]
P0[5]
P0[3]
P0[1]
VDD
VSS
VSS
D+
D-
I2C SCL, SPI SS
I2C SDA, SPI MISO
SPI CLK
ISSP CLK, I2C SCL, SPI MOSI
Ground
USB D+
USB D-
Supply
ISSP DATA, I2C SDA
Optional external clock input
(EXTCLK)
Active high external reset with
internal pull down
Integrating input
Integrating input
Thermal pad must be
connected to Ground
Description
[2, 3]
I2 C SDA, SPI MISO, P1[5]
I2 C SCL, SPI SS, P1[7]
Figure 4. CY8C20396 PSoC Device
SPI CLK, P1[3]
P2[1]
P2[5]
P2[3]
1
2
3
4
5
6
CY8C20X36/46/66/96
( Top View )
QFN
18
15
17
16
14
13
P0[2]
P1[6]
P1[2]
P0[0]
XRES
P1[4] , EXTCLK
Page 10 of 39
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