CY8C20336-24LQXI Cypress Semiconductor Corp, CY8C20336-24LQXI Datasheet - Page 34
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CY8C20336-24LQXI
Manufacturer Part Number
CY8C20336-24LQXI
Description
IC CAPSENSE 20 I/O 8K 24UQFN
Manufacturer
Cypress Semiconductor Corp
Series
CapSense® Controllersr
Datasheet
1.CY8C20236-24LKXI.pdf
(39 pages)
Specifications of CY8C20336-24LQXI
Applications
Capacitive Sensing
Core Processor
M8C
Program Memory Type
FLASH (8 kB)
Controller Series
CY8C20xx6
Ram Size
1K x 8
Interface
I²C, SPI
Number Of I /o
20
Voltage - Supply
1.71 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
24-UQFN Exposed Pad, 24-HUQFN
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Technology
CMOS
Processing Unit
Microprocessor
Operating Supply Voltage (min)
1.71V
Operating Supply Voltage (typ)
1.8/2.5/3.3/5V
Operating Supply Voltage (max)
5.5V
Package Type
QFN EP
Screening Level
Industrial
Pin Count
24
Mounting
Surface Mount
Rad Hardened
No
Processor Series
CY8C20x36
Core
M8C
Data Bus Width
8 bit
Mounting Style
SMD/SMT
Development Tools By Supplier
CY3280-20X66
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
770-1000 - ISP 4PORT FOR CYPRESS PSOC MCU
Lead Free Status / Rohs Status
Details
Other names
428-2942
Thermal Impedances
Table 36. Thermal Impedances per Package
Solder Reflow Peak Temperature
This table lists the minimum solder reflow peak temperature to achieve good solderability.
Table 37. Solder Reflow Peak Temperature
Document Number: 001-12696 Rev. *E
Notes
12. T
13. To achieve the thermal impedance specified for the QFN package, the center thermal pad must be soldered to the PCB ground plane.
14. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5
Refer to the solder manufacturer specifications.
J
= T
A
+ Power x θ
24 QFN
32 QFN
48 QFN
48 SSOP
Package
48 SSOP
Package
16 QFN
24 QFN
32 QFN
48 QFN
16 QFN
JA
.
[13]
[13]
[13]
Minimum Peak Temperature
Typical θ
32.69
20.90
19.51
17.68
69
240
240
240
220
240
o
C/W
o
o
o
o
o
o
o
o
o
C
C
C
C
C
C/W
C/W
C/W
C/W
JA
[12]
[14]
Maximum Peak Temperature
o
C with Sn-Pb or 245 ± 5
CY8C20X36/46/66/96
260
260
260
260
260
o
o
o
o
o
C
C
C
C
C
o
C with Sn-Ag-Cu paste.
Page 34 of 39
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