CY7C64713-56LTXC Cypress Semiconductor Corp, CY7C64713-56LTXC Datasheet - Page 53

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CY7C64713-56LTXC

Manufacturer Part Number
CY7C64713-56LTXC
Description
IC MCU USB PHERIPH FX1 56VQFN
Manufacturer
Cypress Semiconductor Corp
Series
EZ-USB FX1™r
Datasheet

Specifications of CY7C64713-56LTXC

Package / Case
56-VQFN Exposed Pad, 56-HVQFN, 56-SQFN, 56-DHVQFN
Applications
USB Microcontroller
Core Processor
8051
Program Memory Type
ROMless
Controller Series
CY7C647xx
Ram Size
16K x 8
Interface
I²C, USB, USART
Number Of I /o
24
Voltage - Supply
3.15 V ~ 3.45 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Mounting Style
SMD/SMT
Operating Temperature Range
0 C to + 70 C
Operating Supply Voltage
3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
428-1681 - KIT USB FX1 DEVELOPMENT BOARD428-1677 - KIT DEVELOPMENT EZ-USB FX2LP428-1339 - KIT LOW SPEED PERSONALITY BOARD
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
428-2929

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C64713-56LTXC
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
20 000
Company:
Part Number:
CY7C64713-56LTXC
Quantity:
2 600
Document #: 38-08039 Rev. *F
Via hole for thermally connecting the
QFN to the circuit board ground plane.
Figure 41. Cross section of the Area Underneath the QFN Package
PCB Material
Figure 42. Plot of the Solder Mask (White Area)
Figure 43. X-ray Image of the Assembly
Cu Fill
Solder Mask
0.013” dia
0.017” dia
This figure only shows the top three layers of the
circuit board: Top Solder, PCB Dielectric, and
the Ground Plane.
Cu Fill
PCB Material
CY7C64713
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