MPC8250AVRIHBC Freescale Semiconductor, MPC8250AVRIHBC Datasheet - Page 42

• Manufacturer Part Number: MPC8250AVRIHBC
• Description: IC MPU POWERQUICC II 516-PBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8250AVRIHBC

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 200MHz
• Voltage: 1.8V
• Mounting Type: Surface Mount
• Package / Case: 516-PBGA
• Processor Series: MPC8xxx
• Core: 603e
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 200 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: 0 C
• Family Name: MPC82XX
• Device Core: PowerQUICC II
• Device Core Size: 32b
• Frequency (max): 200MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.8V
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 516
• Package Type: TEPBGA
• Leaded Process Compatible: Yes
• Rohs Compliant: Yes
• Peak Reflow Compatible (260 C): Yes
• For Use With: CWH-PPC-8248N-VE - KIT EVAL SYSTEM QUICCSTART 8248
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Pinout
4.2
The following figures and table represent the alternate 516 PBGA package. For information on the
standard package for the MPC8250, refer to
42
1
2
3
4
GNDSYN
CLKIN2
SPARE4
PCI_MODE
SPARE6
THERMAL0
THERMAL1
I/O power
Core Power
Ground
DC current, it is recommended to either pull unused pins to GND or VDDH, or to configure them as outputs.
available at www.freescale.com.
The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive
Must be pulled down or left floating.
If PCI is not desired, this pin should be pulled up or left floating.
For information on how to use this pin, refer to MPC8260 PowerQUICC II Thermal Resistor Guide (AN2271/D)
PBGA Package
2
2
4
3
4
Table 20. MPC8250 TBGA Package Pinout List (continued)
Pin Name
MPC8250 Hardware Specifications, Rev. 2
Section 4.1, “TBGA Package.”
AG21, AG14, AG8, AJ1, AJ2, AH1,
AH2, AG3, AF4, AE5, AC27, Y27,
T27, P27, K26, G27, AE25, AF26,
AG27, AH28, AH29, AJ28, AJ29,
C7, C14, C16, C20, C23, E10, A28,
A29, B28, B29, C27, D26, E25, H3,
M4, T3, AA4, A1, A2, B1, B2, C3,
D4, E5
M1, M2, Y1, Y2, AC1, AC2, AH19,
AJ19, AH10, AJ10, AJ5
AA5, AF21, AF14, AF8, AE7, AF11,
AE17, AE23, AC26, AB25, Y26,
V25, T26, R25, P26, M25, K27, H25,
G26, D7, D10, D14, D16, D20, D23,
C9, E11, E13, E15, E19, E22, B3,
G5, H4, K5, M3, P5, T4, Y5, AA2,
AC3
U28, U29, K28, K29, A9, A19, B19,
Freescale Semiconductor
AE11
AF25
AB1
AA1
AG4
Ball
U5
V4