MPC8347VVALFB Freescale Semiconductor, MPC8347VVALFB Datasheet - Page 91

• Manufacturer Part Number: MPC8347VVALFB
• Description: IC MPU POWERQUICC II 672-TBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II PROr

Specifications of MPC8347VVALFB

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 667MHz
• Voltage: 1.3V
• Mounting Type: Surface Mount
• Package / Case: 672-TBGA
• Processor Series: MPC8xxx
• Core: e300
• Data Bus Width: 32 bit
• Development Tools By Supplier: MPC8349E-MITXE
• Maximum Clock Frequency: 667 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• I/o Voltage: 1.8 V, 2.5 V, 3.3 V
• Minimum Operating Temperature: 0 C
• Family Name: MPC83xx
• Device Core: PowerQUICC II Pro
• Device Core Size: 32b
• Frequency (max): 667MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.3V
• Operating Supply Voltage (max): 1.36V
• Operating Supply Voltage (min): 1.24V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 672
• Package Type: TBGA
• Core Size: 32 Bit
• Program Memory Size: 64KB
• Cpu Speed: 667MHz
• Embedded Interface Type: I2C, SPI, USB, UART
• Digital Ic Case Style: TBGA
• No. Of Pins: 672
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

capacitive loads. This noise must be prevented from reaching other components in the MPC8347EA
system, and the device itself requires a clean, tightly regulated source of power. Therefore, the system
designer should place at least one decoupling capacitor at each V
device. These capacitors should receive their power from separate V
power planes in the PCB, with short traces to minimize inductance. Capacitors can be placed directly under
the device using a standard escape pattern. Others can surround the part.
These capacitors should have a value of 0.01 or 0.1 µF. Only ceramic SMT (surface mount technology)
capacitors should be used to minimize lead inductance, preferably 0402 or 0603 sizes.
In addition, distribute several bulk storage capacitors around the PCB, feeding the V
and LV
have a low ESR (equivalent series resistance) rating to ensure the quick response time. They should also
be connected to the power and ground planes through two vias to minimize inductance. Suggested bulk
capacitors are 100–330 µF (AVX TPS tantalum or Sanyo OSCON).
21.4
To ensure reliable operation, connect unused inputs to an appropriate signal level. Unused active low
inputs should be tied to OV
connected to GND. All NC (no-connect) signals must remain unconnected.
Power and ground connections must be made to all external V
the MPC8347EA.
21.5
The MPC8347EA drivers are characterized over process, voltage, and temperature. For all buses, the
driver is a push-pull single-ended driver type (open drain for I
To measure Z
or GND. Then the value of each resistor is varied until the pad voltage is OV
output impedance is the average of two components, the resistances of the pull-up and pull-down devices.
When data is held high, SW1 is closed (SW2 is open) and R
Freescale Semiconductor
DD
Connection Recommendations
Output Buffer DC Impedance
planes, to enable quick recharging of the smaller chip capacitors. These bulk capacitors should
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 11
0
for the single-ended drivers, an external resistor is connected from the chip pad to OV
DD
, GV
DD
, or LV
DD
as required. Unused active high inputs should be
P
is trimmed until the voltage at the pad equals
DD
2
C).
, GV
DD
, OV
DD
DD
, OV
, LV
DD
, GV
DD
DD
DD
, GV
, OV
/2 (see
DD
, and LV
System Design Information
DD
DD
DD
, LV
, and GND pins of
Figure
, OV
DD
DD
DD
, and GND
43). The
pin of the
, GV
DD
DD
,
91