MPC8260AVVPJDB Freescale Semiconductor, MPC8260AVVPJDB Datasheet - Page 47

IC MPU POWERQUICC II 480-TBGA

MPC8260AVVPJDB

Manufacturer Part Number
MPC8260AVVPJDB
Description
IC MPU POWERQUICC II 480-TBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC8260AVVPJDB

Processor Type
MPC82xx PowerQUICC II 32-bit
Speed
300MHz
Voltage
2V
Mounting Type
Surface Mount
Package / Case
480-TBGA
Family Name
MPC82XX
Device Core
PowerQUICC II
Device Core Size
32b
Frequency (max)
300MHz
Instruction Set Architecture
RISC
Operating Supply Voltage (max)
2.2V
Operating Supply Voltage (min)
1.9V
Operating Temp Range
0C to 105C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
480
Package Type
TBGA
For Use With
MPC8260ADS-TCOM - BOARD DEV ADS POWERQUICC II
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC8260AVVPJDB
Manufacturer:
Rohm
Quantity:
2 595
Part Number:
MPC8260AVVPJDB
Manufacturer:
FREESCALE
Quantity:
173
Part Number:
MPC8260AVVPJDB
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
5.2
Figure 15
package.
Freescale Semiconductor
MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 2.0
Mechanical Dimensions
provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA
Figure 15. Mechanical Dimensions and Bottom Surface Nomenclature
Notes:
1. Dimensions and Tolerancing per
ASME Y14.5M-1994.
2. Dimensions in millimeters.
3. Dimension b is measured at the
maximum solder ball diameter, parallel
to primary data A.
A
A1
A2
A3
b
D
D1
e
E
E1
Dim
1.45
0.60
0.85
0.25
0.65
37.50 BSC
35.56 REF
1.27 BSC
37.50 BSC
35.56 REF
Millimeters
Min
Package Description
1.65
0.70
0.95
0.85
Max
47

Related parts for MPC8260AVVPJDB