MPC8347VRADDB Freescale Semiconductor, MPC8347VRADDB Datasheet - Page 22

• Manufacturer Part Number: MPC8347VRADDB
• Description: IC MPU POWERQUICC II 620-PBGA
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II PROr

Specifications of MPC8347VRADDB

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 266MHz
• Voltage: 1.2V
• Mounting Type: Surface Mount
• Package / Case: 620-PBGA
• Processor Series: MPC8xxx
• Core: e300
• Data Bus Width: 32 bit
• Development Tools By Supplier: MPC8349E-MITXE
• Maximum Clock Frequency: 266 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• I/o Voltage: 1.8 V, 2.5 V, 3.3 V
• Minimum Operating Temperature: 0 C
• Core Size: 32 Bit
• Program Memory Size: 64KB
• Cpu Speed: 266MHz
• Embedded Interface Type: I2C, SPI, USB, UART
• Digital Ic Case Style: BGA
• No. Of Pins: 672
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Ethernet: Three-Speed Ethernet, MII Management
8
This section provides the AC and DC electrical characteristics for three-speeds (10/100/1000 Mbps) and
MII management.
8.1
The electrical characteristics specified here apply to the gigabit media independent interface (GMII), the
media independent interface (MII), ten-bit interface (TBI), reduced gigabit media independent
interface (RGMII), and reduced ten-bit interface (RTBI) signals except management data input/output
(MDIO) and management data clock (MDC). The MII, GMII, and TBI interfaces are defined for 3.3 V,
and the RGMII and RTBI interfaces are defined for 2.5 V. The RGMII and RTBI interfaces follow the
Hewlett-Packard Reduced Pin-Count Interface for Gigabit Ethernet Physical Layer Device Specification,
Version 1.2a (9/22/2000). The electrical characteristics for MDIO and MDC are specified in
“Ethernet Management Interface Electrical Characteristics.”
8.1.1
GMII, MII, TBI, RGMII, and RTBI drivers and receivers comply with the DC parametric attributes
specified in
interface voltage as defined by JEDEC EIA/JESD8-5.
22
Supply voltage 3.3 V
Output high voltage
Output low voltage
Input high voltage
Input low voltage
Input high current
Input low current
Notes:
1. The symbol V
2. GMII/MII pins not needed for RGMII or RTBI operation are powered by the OV
Ethernet: Three-Speed Ethernet, MII Management
Three-Speed Ethernet Controller (TSEC)—
GMII/MII/TBI/RGMII/RTBI Electrical Characteristics
Parameter
MPC8347E PowerQUICC™ II Pro Integrated Host Processor Hardware Specifications, Rev. 11
TSEC DC Electrical Characteristics
Table 19
IN
, in this case, represents the LV
and
Table 19. GMII/TBI and MII DC Electrical Characteristics
Table
20. The RGMII and RTBI signals in
Symbol
LV
V
V
V
V
I
I
OH
IH
DD
OL
IL
IH
IL
2
IN
I
symbol referenced in
OH
I
OL
= –4.0 mA
= 4.0 mA
—
—
V
Conditions
V
IN
IN
1
1
—
= LV
= GND
LV
LV
DD
Table 1
DD
DD
—
—
= Min
= Min
DD
Table 20
and
supply.
Table
GND
–600
2.97
2.40
–0.3
Min
are based on a 2.5-V CMOS
2.
2.0
—
Freescale Semiconductor
LV
LV
DD
DD
Max
3.63
0.50
0.90
40
—
+ 0.3
+ 0.3
Section 8.3,
Unit
μA
μA
V
V
V
V
V