MPC860PZQ80D4 Freescale Semiconductor, MPC860PZQ80D4 Datasheet - Page 75
![IC MPU POWERQUICC 80MHZ 357PBGA](/photos/6/76/67680/mfg_mpc860_series_sml.jpg)
MPC860PZQ80D4
Manufacturer Part Number
MPC860PZQ80D4
Description
IC MPU POWERQUICC 80MHZ 357PBGA
Manufacturer
Freescale Semiconductor
Datasheet
1.MC860DECVR50D4R2.pdf
(80 pages)
Specifications of MPC860PZQ80D4
Processor Type
MPC8xx PowerQUICC 32-Bit
Speed
80MHz
Voltage
3.3V
Mounting Type
Surface Mount
Package / Case
357-PBGA
Processor Series
MPC8xx
Core
MPC8xx
Data Bus Width
32 bit
Maximum Clock Frequency
80 MHz
Operating Supply Voltage
2.5 V, 3.3 V
Maximum Operating Temperature
+ 95 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
0 C
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC860PZQ80D4
Manufacturer:
MOTOLOLA
Quantity:
465
Company:
Part Number:
MPC860PZQ80D4
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC860PZQ80D4
Manufacturer:
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Company:
Part Number:
MPC860PZQ80D4R2
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Figure 78
Freescale Semiconductor
Figure 78. Mechanical Dimensions and Bottom Surface Nomenclature of the ZQ PBGA Package
shows the mechanical dimensions of the ZQ PBGA package.
1.
2.
3.
4.
All Dimensions in millimeters.
Dimensions and tolerance per ASME Y14.5M, 1994.
Maximum Solder Ball Diameter measured parallel to Datum A.
Datum A, the seating plane, is defined by the spherical crowns of the solder balls.
MPC860 PowerQUICC™ Family Hardware Specifications, Rev. 8
NOTE
Mechanical Data and Ordering Information
75