MPC8360EZUAJDGA Freescale Semiconductor, MPC8360EZUAJDGA Datasheet - Page 10

IC MPU POWERQUICC II PRO 740TBGA

MPC8360EZUAJDGA

Manufacturer Part Number
MPC8360EZUAJDGA
Description
IC MPU POWERQUICC II PRO 740TBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC8360EZUAJDGA

Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
533MHz
Voltage
1.2V
Mounting Type
Surface Mount
Package / Case
740-TBGA
Processor Series
MPC8xxx
Core
e300
Data Bus Width
32 bit
Development Tools By Supplier
MPC8360E-RDK
Maximum Clock Frequency
533 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
I/o Voltage
1.8 V, 2.5 V, 3.3 V
Minimum Operating Temperature
0 C
For Use With
MPC8360EA-MDS-PB - KIT APPLICATION DEV 8360 SYSTEMMPC8360E-RDK - BOARD REFERENCE DESIGN FOR MPC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC8360EZUAJDGA
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Electrical Characteristics
2.1.2
Table 2
the recommended and tested operating conditions. Proper device operation outside of these conditions is
not guaranteed.
10
Core supply voltage
frequencies <667 MHz
frequency of 667 MHz
PLL supply voltage
frequencies <667 MHz
frequency of 667 MHz
DDR and DDR2 DRAM I/O supply voltage
Three-speed Ethernet I/O supply voltage
Three-speed Ethernet I/O supply voltage
Three-speed Ethernet I/O supply voltage
PCI, local bus, DUART, system control and power management, I
and JTAG I/O voltage
Junction temperature
Notes:
1. GV
2. The operating conditions for junction temperature, T
For QUICC Engine module frequencies <500 MHz and e300
For a QUICC Engine module frequency of 500 MHz or an e300
For QUICC Engine module frequencies <500 MHz and e300
For a QUICC Engine module frequency of 500 MHz or an e300
negative direction.
0° to 70 °C. Refer to Errata General9 in Chip Errata for the MPC8360E, Rev. 1 .
MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 4
DD
, LV
provides the recommended operating conditions for the device. Note that the values in
DD
Power Supply Voltage Specification
, OV
DD
, AV
DD
, and V
Characteristic
DD
Table 2. Recommended Operating Conditions
must track each other and must vary in the same direction—either in the positive or
J
, on the 600/333/400 MHz and 500/333/500 MHz on rev. 2.0 silicon is
2
C, SPI,
DDR2
DDR
Symbol
LV
LV
LV
GV
OV
AV
V
T
DD
DD
DD
DD
DD
DD
DD
J
0
1
2
Recommended
2.5 V ± 125 mV
3.3 V ± 330 mV
2.5 V ± 125 mV
3.3 V ± 330 mV
2.5 V ± 125 mV
3.3 V ± 330 mV
2.5 V ± 125 mV
3.3 V ± 330 mV
1.2 V ± 60 mV
1.3 V ± 50 mV
1.2 V ± 60 mV
1.3 V ± 50 mV
1.8 V ± 90 mV
–40 to 105
0 to 105
Value
Freescale Semiconductor
Unit
°C
V
V
V
V
V
V
V
Table 2
Notes
2
1
1
are

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