MPC8260AZUMHBB Freescale Semiconductor, MPC8260AZUMHBB Datasheet - Page 19

IC MPU POWERQUICC II 480-TBGA

MPC8260AZUMHBB

Manufacturer Part Number
MPC8260AZUMHBB
Description
IC MPU POWERQUICC II 480-TBGA
Manufacturer
Freescale Semiconductor
Datasheets

Specifications of MPC8260AZUMHBB

Processor Type
MPC82xx PowerQUICC II 32-bit
Speed
266MHz
Voltage
2V
Mounting Type
Surface Mount
Package / Case
480-TBGA
Processor Series
MPC8xxx
Core
603e
Data Bus Width
32 bit
Maximum Clock Frequency
266 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
0 C
Leaded Process Compatible
Yes
Peak Reflow Compatible (260 C)
No
Rohs Compliant
No
For Use With
MPC8260ADS-TCOM - BOARD DEV ADS POWERQUICC II
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Table 10
Freescale Semiconductor
1
Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal.
Timings are measured at the pin.
sp33a
sp33b
MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 2.0
sp31
sp32
sp34
sp35
Max
lists SIU output characteristics.
Spec Number
Activating data pipelining (setting BRx[DR] in the memory controller)
improves the AC timing. When data pipelining is activated, sp12 can be
used for data bus setup even when ECC or PARITY are used. Also, sp33a
can be used as the AC specification for DP signals.
sp30
sp30
sp30
sp30
sp30
sp30
Min
PSDVAL/TEA/TA
ADD/ADD_atr./BADDR/CI/GBL/WT
Data bus
DP
Memory controller signals/ALE
All other signals
Table 10. AC Characteristics for SIU Outputs
Characteristic
NOTE
66 MHz 83 MHz 66 MHz 83 MHz
Max Delay (ns)
6.5
7
8
8
6
6
1
Electrical and Thermal Characteristics
6.5
6.5
5.5
6
7
5
Min Delay (ns)
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
19

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