MC7447AHX1420LB Freescale Semiconductor, MC7447AHX1420LB Datasheet - Page 43

• Manufacturer Part Number: MC7447AHX1420LB
• Description: IC MPU RISC 1420MHZ 360-FCCBGA
• Manufacturer: Freescale Semiconductor

Specifications of MC7447AHX1420LB

• Processor Type: MPC74xx PowerPC 32-Bit
• Speed: 1.42GHz
• Voltage: 1.3V
• Mounting Type: Surface Mount
• Package / Case: 360-FCCBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

9.8
This section provides thermal management information for the high coefficient of thermal expansion
(HCTE) package for air-cooled applications. Proper thermal control design is primarily dependent on the
system-level design—the heat sink, airflow, and thermal interface material. The MPC7447A implements
several features designed to assist with thermal management, including DFS and the temperature diode.
DFS reduces the power consumption of the device by reducing the core frequency; see
“Power Consumption with DFS Enabled,”
The temperature diode allows an external device to monitor the die temperature in order to detect excessive
temperature conditions and alert the system; see
information.
To reduce the die-junction temperature, heat sinks may be attached to the package by several
methods—spring clip to holes in the printed-circuit board or package, and mounting clip and screw
assembly (see
attachment through the printed-circuit board is suggested. In any implementation of a heat sink solution,
the force on the die should not exceed ten pounds.
Freescale Semiconductor
Figure 20. BGA Package Exploded Cross-Sectional View with Several Heat Sink Options
Thermal Management Information
Figure 20
A clip on heat sink is not recommended for LGA because there may not be
adequate clearance between the device and the circuit board. A through-hole
solution is recommended, as shown in
MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
and
Interface Material
Figure
Heat Sink
Thermal
Heat Sink
21); however, due to the potential large mass of the heat sink,
Clip
for specific information regarding power reduction and DFS.
Printed-Circuit Board
Section 9.8.4, “Temperature Diode,”
NOTE
Figure 21
HCTE BGA Package
below.
System Design Information
for more
Section 9.8.5.1,
43