MPC8250ACVVMHBC Freescale Semiconductor, MPC8250ACVVMHBC Datasheet - Page 42

IC MPU POWERQUICC II 480-TBGA

MPC8250ACVVMHBC

Manufacturer Part Number
MPC8250ACVVMHBC
Description
IC MPU POWERQUICC II 480-TBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC8250ACVVMHBC

Processor Type
MPC82xx PowerQUICC II 32-bit
Speed
266MHz
Voltage
2V
Mounting Type
Surface Mount
Package / Case
480-TBGA
Family Name
MPC82XX
Device Core
PowerQUICC II
Device Core Size
32b
Frequency (max)
266MHz
Instruction Set Architecture
RISC
Operating Supply Voltage (max)
2.2V
Operating Supply Voltage (min)
1.9V
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
480
Package Type
TBGA
Leaded Process Compatible
Yes
Rohs Compliant
Yes
Peak Reflow Compatible (260 C)
Yes
For Use With
CWH-PPC-8248N-VE - KIT EVAL SYSTEM QUICCSTART 8248
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Compliant

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC8250ACVVMHBC
Manufacturer:
FREESCAL
Quantity:
390
Part Number:
MPC8250ACVVMHBC
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC8250ACVVMHBC
Manufacturer:
FREESCALE
Quantity:
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Pinout
4.2
The following figures and table represent the alternate 516 PBGA package. For information on the
standard package for the MPC8250, refer to
42
1
2
3
4
GNDSYN
CLKIN2
SPARE4
PCI_MODE
SPARE6
THERMAL0
THERMAL1
I/O power
Core Power
Ground
DC current, it is recommended to either pull unused pins to GND or VDDH, or to configure them as outputs.
available at www.freescale.com.
The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive
Must be pulled down or left floating.
If PCI is not desired, this pin should be pulled up or left floating.
For information on how to use this pin, refer to MPC8260 PowerQUICC II Thermal Resistor Guide (AN2271/D)
PBGA Package
2
2
4
3
4
Table 20. MPC8250 TBGA Package Pinout List (continued)
Pin Name
MPC8250 Hardware Specifications, Rev. 2
Section 4.1, “TBGA Package.”
AG21, AG14, AG8, AJ1, AJ2, AH1,
AH2, AG3, AF4, AE5, AC27, Y27,
T27, P27, K26, G27, AE25, AF26,
AG27, AH28, AH29, AJ28, AJ29,
C7, C14, C16, C20, C23, E10, A28,
A29, B28, B29, C27, D26, E25, H3,
M4, T3, AA4, A1, A2, B1, B2, C3,
D4, E5
M1, M2, Y1, Y2, AC1, AC2, AH19,
AJ19, AH10, AJ10, AJ5
AA5, AF21, AF14, AF8, AE7, AF11,
AE17, AE23, AC26, AB25, Y26,
V25, T26, R25, P26, M25, K27, H25,
G26, D7, D10, D14, D16, D20, D23,
C9, E11, E13, E15, E19, E22, B3,
G5, H4, K5, M3, P5, T4, Y5, AA2,
AC3
U28, U29, K28, K29, A9, A19, B19,
Freescale Semiconductor
AE11
AF25
AB1
AA1
AG4
Ball
U5
V4

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