MC7447AHX1000LB Freescale Semiconductor, MC7447AHX1000LB Datasheet - Page 44

• Manufacturer Part Number: MC7447AHX1000LB
• Description: IC MPU RISC 32BIT 360-FCCBGA
• Manufacturer: Freescale Semiconductor

Specifications of MC7447AHX1000LB

• Processor Type: MPC74xx PowerPC 32-Bit
• Speed: 1.0GHz
• Voltage: 1.3V
• Mounting Type: Surface Mount
• Package / Case: 360-FCCBGA
• Family Name: MPC74xx
• Device Core: PowerPC
• Device Core Size: 32b
• Frequency (max): 1GHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.3V
• Operating Supply Voltage (max): 1.35V
• Operating Supply Voltage (min): 1.25V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 360
• Package Type: FCCBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

System Design Information
The board designer can choose between several types of heat sinks to place on the MPC7447A. There are
several commercially-available heat sinks for the MPC7447A provided by the following vendors:
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
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Aavid Thermalloy
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
473 Sapena Ct. #12
Santa Clara, CA 95054
Internet: www.alphanovatech.com
Calgreg Thermal Solutions
60 Alhambra Road
Warwick, RI 02886
Internet: www.calgregthermalsolutions.com
International Electronic Research Corporation (IERC)
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Tyco Electronics
Chip Coolers™
P.O. Box 3608
Harrisburg, PA 17105-3608
Internet: www.chipcoolers.com
Wakefield Engineering
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Figure 21. LGA Package Exploded Cross-Sectional View with Several Heat Sink Options
MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
Interface Material
Heat Sink
Thermal
Heat Sink
Clip
Printed-Circuit Board
HCTE LGA Package
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