TSPC603RVGH10LC Atmel, TSPC603RVGH10LC Datasheet - Page 47

• Manufacturer Part Number: TSPC603RVGH10LC
• Description: IC MPU 32BIT 10MHZ 255CBGA
• Manufacturer: Atmel

Specifications of TSPC603RVGH10LC

• Processor Type: PowerPC 603e 32-Bit RISC
• Speed: 233MHz
• Voltage: 2.5V
• Mounting Type: Surface Mount
• Package / Case: 255-CBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

15. Package Mechanical Data
15.1
5410B–HIREL–09/05
HiTCE CBGA Package Parameters
The following sections provide the package parameters and mechanical dimensions for the
CBGA, HiTCE CBGA and the Cerquad packages.
The package parameters are as provided in the following list. The package type is 21 mm, 255-
lead HiTCE Ceramic Ball Array (HiTCE CBGA).
Package outline
Interconnects
Pitch
Maximum module height
255
1.27 mm
21 mm × 21 mm
3.08 mm
TSPC603R
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