MPC8321CZQADDC Freescale Semiconductor, MPC8321CZQADDC Datasheet - Page 35

IC MPU PWRQUICC II 516-PBGA

MPC8321CZQADDC

Manufacturer Part Number
MPC8321CZQADDC
Description
IC MPU PWRQUICC II 516-PBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC8321CZQADDC

Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
266MHz
Voltage
1V
Mounting Type
Surface Mount
Package / Case
516-PBGA
Processor Series
MPC8xxx
Core
e300
Data Bus Width
32 bit
Development Tools By Supplier
MPC8323E-MDS-PB
Maximum Clock Frequency
266 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Data Ram Size
16 KB
I/o Voltage
1.8 V, 3.3 V
Interface Type
I2C, SPI, UART
Minimum Operating Temperature
- 40 C
Family Name
MPC83xx
Device Core
PowerQUICC II Pro
Device Core Size
32b
Frequency (max)
266MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
1V
Operating Supply Voltage (max)
1.05V
Operating Supply Voltage (min)
0.95V
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
516
Package Type
TEBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC8321CZQADDC
Manufacturer:
MOTOROLA
Quantity:
996
Part Number:
MPC8321CZQADDC
Manufacturer:
Freescale Semiconductor
Quantity:
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12 PCI
This section describes the DC and AC electrical specifications for the PCI bus of the MPC8323E.
12.1
Table 35
12.2
This section describes the general AC timing parameters of the PCI bus of the MPC8323E. Note that the
PCI_CLK or PCI_SYNC_IN signal is used as the PCI input clock depending on whether the MPC8323E
is configured as a host or agent device.
Freescale Semiconductor
High-level input voltage
Low-level input voltage
High-level output voltage
Low-level output voltage
Input current
Notes:
1. Note that the symbol V
2. Ranges listed do not meet the full range of the DC specifications of the PCI 2.3 Local Bus Specifications.
Clock to output valid
Output hold from clock
Clock to output high impedence
Input setup to clock
Input hold from clock
Notes:
1. The symbols used for timing specifications follow the pattern of t
2. See the timing measurement conditions in the PCI 2.3 Local Bus Specifications .
3. For purposes of active/float timing measurements, the Hi-Z or off state is defined to be when the total current delivered
4. Input timings are measured at the pin.
.
inputs and t
(PC) with respect to the time the input signals (I) reach the valid state (V) relative to the PCI_SYNC_IN clock, t
(K) going to the high (H) state or setup time. Also, t
(R) went high (H) relative to the frame signal (F) going to the valid (V) state.
through the component pin is less than or equal to the leakage current specification.
MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4
provides the DC electrical characteristics for the PCI interface of the MPC8323E.
PCI DC Electrical Characteristics
PCI AC Electrical Specifications
(first two letters of functional block)(reference)(state)(signal)(state)
Parameter
Parameter
IN
, in this case, represents the OV
Table 36. PCI AC Timing Specifications at 66 MHz
Table 35. PCI DC Electrical Characteristics
Symbol
Table 36
V
V
V
V
I
OH
IN
OL
IH
IL
PCRHFV
shows the PCI AC timing specifications at 66 MHz.
IN
V
V
OUT
0 V ≤ V
symbolizes PCI timing (PC) with respect to the time hard reset
symbol referenced in
Test Condition
OUT
Symbol
I
t
t
t
OH
PCKHOV
PCKHOX
I
t
t
OV
OV
PCKHOZ
OL
PCIVKH
PCIXKH
≥ V
(first two letters of functional block)(signal)(state)(reference)(state)
≤ V
DD
= –100 μA
DD
= 100 μA
for outputs. For example, t
IN
OH
= min,
= min,
OL
1
≤ OV
(min) or
(max)
DD
Min
3.0
1
0
Table 1
OV
1,2
DD
–0.3
Min
2
and
– 0.2
PCIVKH
Max
Table
6.0
14
symbolizes PCI timing
OV
2.
DD
Max
0.8
0.2
±5
Unit
+ 0.3
ns
ns
ns
ns
ns
SYS
, reference
Notes
Unit
2, 3
2, 4
2, 4
μA
for
V
V
V
V
2
2
PCI
35

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