SA56004HDP-T NXP Semiconductors, SA56004HDP-T Datasheet - Page 36

• Manufacturer Part Number: SA56004HDP-T
• Description: Board Mount Temperature Sensors I2C LOC +/- 2OC AND REM +/- 1OC TS
• Manufacturer: NXP Semiconductors

Specifications of SA56004HDP-T

• Full Temp Accuracy: +/- 1 C, +/- 3 C
• Package / Case: SOT-505
• Digital Output - Bus Interface: I2C
• Digital Output - Number Of Bits: 11 bit
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Output Type: Digital
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: SA56004HDP,118

NXP Semiconductors
20. Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.8.1
7.8.2
7.8.3
7.8.4
7.8.5
7.8.6
7.8.7
7.8.8
7.8.9
7.8.10
7.9
7.9.1
7.9.1.1
7.9.1.2
7.9.1.3
7.9.2
7.9.3
7.9.4
7.9.5
7.10
7.10.1
8
9
10
11
12
13
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Simplified system diagram . . . . . . . . . . . . . . . 20
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 21
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 22
Performance curves . . . . . . . . . . . . . . . . . . . . 25
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 27
Packing information. . . . . . . . . . . . . . . . . . . . . 30
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Serial bus interface . . . . . . . . . . . . . . . . . . . . . . 5
Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Register overview . . . . . . . . . . . . . . . . . . . . . . . 5
Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 6
Starting conversion . . . . . . . . . . . . . . . . . . . . . . 7
Low power software standby mode . . . . . . . . . 7
Temperature data format . . . . . . . . . . . . . . . . . 7
SA56004X SMBus registers . . . . . . . . . . . . . . . 8
Command register . . . . . . . . . . . . . . . . . . . . . . 8
Local and remote temperature registers
(LTHB, LTLB, RTHB, RTLB) . . . . . . . . . . . . . . . 8
Configuration register (CON) . . . . . . . . . . . . . . 8
Status register (SR) . . . . . . . . . . . . . . . . . . . . . 9
Conversion rate register (CR) . . . . . . . . . . . . . 10
Temperature limit registers . . . . . . . . . . . . . . . 10
Programmable offset register (remote only) . . 11
ALERT mode register (AM) . . . . . . . . . . . . . . 11
Other registers . . . . . . . . . . . . . . . . . . . . . . . . 11
One-shot register . . . . . . . . . . . . . . . . . . . . . . 11
Interruption logic and functional description . . 12
ALERT output . . . . . . . . . . . . . . . . . . . . . . . . . 12
ALERT output in comparator mode . . . . . . . . 12
ALERT output in interrupt mode . . . . . . . . . . . 12
ALERT output in SMBus ALERT mode . . . . . 13
T_CRIT output . . . . . . . . . . . . . . . . . . . . . . . . 15
Fault Queue . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Remote diode selection . . . . . . . . . . . . . . . . . 17
Diode fault detection . . . . . . . . . . . . . . . . . . . . 17
SMBus interface . . . . . . . . . . . . . . . . . . . . . . . 18
Serial interface reset. . . . . . . . . . . . . . . . . . . . 20
Digital temperature sensor with overtemperature alarms
14
14.1
14.2
14.3
14.4
15
15.1
16
17
18
18.1
18.2
18.3
18.4
19
20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Soldering of SMD packages . . . . . . . . . . . . . . 30
Mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 33
Revision history . . . . . . . . . . . . . . . . . . . . . . . 34
Legal information . . . . . . . . . . . . . . . . . . . . . . 35
Contact information . . . . . . . . . . . . . . . . . . . . 35
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Introduction to soldering. . . . . . . . . . . . . . . . . 30
Wave and reflow soldering . . . . . . . . . . . . . . . 30
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 31
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 31
Printed-circuit board layout considerations . . 32
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 35
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 35
SA56004X
Document identifier: SA56004X_5
Date of release: 22 May 2008
All rights reserved.