STTS424E02CDA6F STMicroelectronics, STTS424E02CDA6F Datasheet - Page 47

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STTS424E02CDA6F

Manufacturer Part Number
STTS424E02CDA6F
Description
Board Mount Temperature Sensors MEM Module Temp Sens 2Kb SPD
Manufacturer
STMicroelectronics
Datasheet

Specifications of STTS424E02CDA6F

Full Temp Accuracy
+/- 3 C
Package / Case
DFN EP
Digital Output - Bus Interface
Serial (2-Wire, I2C)
Digital Output - Number Of Bits
10 bit
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Output Type
Analog
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
STTS424E02
12
Landing pattern
The landing pattern recommendations per the JEDEC proposal for the TDFN package (DN)
are shown in
The preferred implementation with wide corner pads enhances device centering during
assembly, but a narrower option is defined for modules with tight routing requirements.
Figure 21. Landing pattern - TDFN package (DN)
Figure
E3
E3
21.
L
K
L
K
Doc ID 13448 Rev 8
b4
b2
e4
K2
e2
D2/2
e/2
e
b
D2
K2
b
e/2
D2/2
K2
E2/2
E2/2
Landing pattern
E2
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