STTS424E02CDA6F STMicroelectronics, STTS424E02CDA6F Datasheet - Page 48

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STTS424E02CDA6F

Manufacturer Part Number
STTS424E02CDA6F
Description
Board Mount Temperature Sensors MEM Module Temp Sens 2Kb SPD
Manufacturer
STMicroelectronics
Datasheet

Specifications of STTS424E02CDA6F

Full Temp Accuracy
+/- 3 C
Package / Case
DFN EP
Digital Output - Bus Interface
Serial (2-Wire, I2C)
Digital Output - Number Of Bits
10 bit
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Output Type
Analog
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Landing pattern
Table 33.
1. Minimum acceptable option to be used when routing prevents preferred width contact.
2. Preferred option to be used when possible.
48/50
Parameter
D2
E2
E3
K2
e2
b2
e4
b4
K
L
e
b
Heat paddle width
Heat paddle height
Heat paddle centerline to contact inner locus
Contact length
Heat paddle to contact keepout
Contact to contact keepout
Contact centerline to contact centerline pitch for inner contacts
Contact width for inner contacts
Landing pattern centerline to outer contact centerline, “minimum
acceptable” option
Corner contact width, “minimum acceptable option”
Landing pattern centerline to outer contact centerline, “preferred”
option
Corner contact width, “preferred” option
Table 33
“Minimum Acceptable” based on the JEDEC proposal.
Parameters for landing pattern - TDFN package (DN)
(2)
lists variations of landing pattern implementations, ranked as “Preferred” and
(1)
Description
Doc ID 13448 Rev 8
(2)
(1)
1.40
1.40
1.00
0.70
0.20
0.20
0.25
0.25
0.45
Min
-
-
-
Dimension
Nom
0.50
0.50
0.60
-
-
-
-
-
-
-
-
-
STTS424E02
Max
1.60
1.60
0.80
0.30
0.30
0.50
-
-
-
-
-
-

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