NE1617DS NXP Semiconductors, NE1617DS Datasheet - Page 14

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NE1617DS

Manufacturer Part Number
NE1617DS
Description
Board Mount Temperature Sensors I2C LOC +/- 2OC AND REM +/- 3OC TS
Manufacturer
NXP Semiconductors
Datasheet

Specifications of NE1617DS

Full Temp Accuracy
+/- 3 C, +/- 5 C
Package / Case
SSOP-16
Digital Output - Bus Interface
2-Wire
Maximum Operating Temperature
+ 120 C
Minimum Operating Temperature
0 C
Output Type
Digital
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
NE1617DS,112

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PC BOARD LAYOUT CONSIDERATION
Because the NE1617 is used to measure a very small voltage from
the remote sensor, care must be taken to minimize noise induced at
the sensor inputs, especially in the computer motherboard noisy
environment. These precautions should be considered:
– Place the NE1617 as close as possible to the remote sensor. It
– Route the D+ and D– lines in parallel and close together with
– Leakage currents due to PC board contamination must be
– Use wide tracks to reduce inductance and noise pickup that may
2004 Oct 06
can be from 4 to 8 inches, as long as the worst noise sources
such as clock generator, data and address buses, CRTs are
avoided.
ground guards enclosed.
considered. Error can be introduced by the leakage current as
shown on the characteristics curve (Temperature Error vs. PC
Board Resistance).
be introduced by narrow ones. The width of 10 mil and space of
10 mil are recommended.
Temperature monitor for microprocessor systems
14
– Place a bypass capacitor of 0.1 F close to the V
– A shielded twisted pair is recommended for a long distance
input filter capacitor of 2200 pF close to the D+ and D– pins.
remote sensor. Connect the shield of the cable at the device side
to the NE1617 GND pin and leave the shield at the remote end
unconnected to avoid ground loop. Also notice that the series
resistance of the cable may introduce measurement error; 1
can introduce about 0.5 C.
GND
GND
D+
D–
Product specification
NE1617
DD
pin and an
SL01218

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