SC18IS602BIPW,112 NXP Semiconductors, SC18IS602BIPW,112 Datasheet - Page 25
![IC BRIDGE SPI/I2C 16-TSSOP](/photos/6/56/65607/568-16-tssop_sot403-1_sml.jpg)
SC18IS602BIPW,112
Manufacturer Part Number
SC18IS602BIPW,112
Description
IC BRIDGE SPI/I2C 16-TSSOP
Manufacturer
NXP Semiconductors
Specifications of SC18IS602BIPW,112
Controller Type
I²C Bus Controller
Interface
I²C
Voltage - Supply
2.4 V ~ 3.6 V
Current - Supply
11mA
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-TSSOP
Operating Temperature Classification
Military
Operating Temperature (max)
125C
Package Type
TSSOP
Rad Hardened
No
Maximum Operating Frequency
4.5 MHz
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 55 C
Mounting Style
SMD/SMT
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2.4 V
For Use With
568-4705 - DEMO BOARD I2C TO SPI SC18IS602
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-4785-5
935286182112
SC18IS602BIPW
SC18IS602BIPW,112
SC18IS602BIPW
935286182112
SC18IS602BIPW
SC18IS602BIPW,112
SC18IS602BIPW
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SC18IS602BIPW,112
Manufacturer:
NXP
Quantity:
463
NXP Semiconductors
18. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
7.1.1
7.1.2
7.1.3
7.1.4
7.1.5
7.1.6
7.1.7
7.1.8
7.1.9
7.1.10
7.1.11
7.1.11.1
7.1.11.2
7.1.11.3
7.1.11.4
7.2
8
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 4
I
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 14
Static characteristics. . . . . . . . . . . . . . . . . . . . 15
Dynamic characteristics . . . . . . . . . . . . . . . . . 16
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18
Soldering of SMD packages . . . . . . . . . . . . . . 19
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 22
Legal information. . . . . . . . . . . . . . . . . . . . . . . 23
Contact information. . . . . . . . . . . . . . . . . . . . . 24
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2
C-bus to SPI communications example . . . 13
I
SPI read and write - Function ID 01h to 0Fh . . 5
Configure SPI Interface - Function ID F0h . . . . 7
Clear Interrupt - Function ID F1h . . . . . . . . . . . 8
GPIO Read - Function ID F5h . . . . . . . . . . . . . 9
GPIO Configuration - Function ID F7h . . . . . . 10
Quasi-bidirectional output configuration . . . . . 10
Wave and reflow soldering . . . . . . . . . . . . . . . 19
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Write to data buffer . . . . . . . . . . . . . . . . . . . . . . 5
Read from buffer. . . . . . . . . . . . . . . . . . . . . . . . 6
Idle mode - Function ID F2h . . . . . . . . . . . . . . . 8
GPIO Write - Function ID F4h. . . . . . . . . . . . . . 8
GPIO Enable - Function ID F6h . . . . . . . . . . . . 9
Open-drain output configuration . . . . . . . . . . . 11
Input-only configuration . . . . . . . . . . . . . . . . . 12
Push-pull output configuration . . . . . . . . . . . . 12
SPI interface . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Introduction to soldering . . . . . . . . . . . . . . . . . 19
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 19
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 20
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 23
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 24
2
C-bus interface. . . . . . . . . . . . . . . . . . . . . . . . 4
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
SC18IS602B
I
2
Document identifier: SC18IS602B
C-bus to SPI bridge
Date of release: 3 August 2010
All rights reserved.