PEB2075N-V13TR Infineon Technologies, PEB2075N-V13TR Datasheet - Page 12

• Manufacturer Part Number: PEB2075N-V13TR
• Description: IC CONTROLLER D-CH EXCH 44-PLCC
• Manufacturer: Infineon Technologies

Specifications of PEB2075N-V13TR

• Controller Type: Digital Exchange Controller
• Interface: PCM
• Voltage - Supply: 4.75 V ~ 5.25 V
• Current - Supply: 10mA
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 44-PLCC
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: PEB2075N-V13INTR; PEB2075N-V13TR

Features
Line Cards in De-Centralized or Mixed Signaling / Data Packet Handling Architectures
The IDEC can be used on peripheral line cards to process D-channel packets for ISDN subscribers.
The PCM Controller PEB 2055 has the layer-1 controlling capacity and a B-channel switching
capacity for a total of 32 subscribers. The B and D channels and the control information for eight
subscribers are carried by one IOM interface. Thus a line card dimensioned for 32-ISDN
subscribers may employ up to eight IDECs, two for each IOM connection (figure 2). A High Level
Serial Communication Controller (HSCX) SAB 82525 with two HDLC channels, or another IDEC
may be used to transmit and receive signaling via the system highway in a common channel. Again,
such a common channel may be shared among several line cards, due to the statistical multiplexing
capability of these controllers.
In completely de-centralized D-channel processing architectures, the processing capacity of a line
card is usually dimensioned so as to avoid blocking situations even under maximum conceivable
D-channel traffic conditions. It may sometimes be more advantageous to perform p-packet handling
in a centralized manner while keeping s-packet handling on the line cards. A statistical increase in
p-packet traffic has then no effect on the line card, and can be easily dealt with by one of the
modular architectures for a central packet handler shown in the previous section. A more effective
sharing of the total p-packet handling capacity is the result, especially in a situation where p-packet
traffic patterns vary widely from one subscriber group to another.
The use of an IDEC in the mixed D-channel processing architecture is illustrated in figure 3.
The additional "transparent data" connections supported by the IDEC enable a merging of p and s
packets into one D channel. Possible collision situations are dealt with by the IDEC which uses
either the additional collision detect line (figure 3) or a time slot on the system highway (figure 3)
from the line card to the central packet handler.
Semiconductor Group
12