TDA8023TT/C1,118 NXP Semiconductors, TDA8023TT/C1,118 Datasheet - Page 32

• Manufacturer Part Number: TDA8023TT/C1,118
• Description: IC SMART CARD INTERFACE 28-TSSOP
• Manufacturer: NXP Semiconductors

Specifications of TDA8023TT/C1,118

• Package / Case: 28-TSSOP
• Controller Type: Smart Card Interface
• Interface: I²C
• Voltage - Supply: 2.7 V ~ 6.5 V
• Current - Supply: 200mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935274975118; TDA8023TT-T; TDA8023TT-T

NXP Semiconductors
18. Contents
1
2
3
4
5
6
7
7.1
7.2
8
8.1
8.2
8.2.1
8.2.2
8.2.3
8.2.4
8.3
8.3.1
8.3.2
8.3.3
8.3.4
8.3.5
8.4
8.4.1
8.4.2
8.5
8.6
8.6.1
8.6.2
8.7
9
10
11
12
13
14
14.1
14.2
14.3
14.4
15
16
16.1
16.2
16.3
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 6
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 16
Thermal characteristics. . . . . . . . . . . . . . . . . . 16
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 17
Application information. . . . . . . . . . . . . . . . . . 24
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 26
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 30
Legal information. . . . . . . . . . . . . . . . . . . . . . . 31
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Power supplies . . . . . . . . . . . . . . . . . . . . . . . . . 6
Voltage supervisor . . . . . . . . . . . . . . . . . . . . . . 6
Without external divider on pin PORADJ . . . . . 6
With external divider on pin PORADJ. . . . . . . . 7
External capacitor on pin CDEL . . . . . . . . . . . . 7
Shutdown mode . . . . . . . . . . . . . . . . . . . . . . . . 8
I
I
Bus conditions . . . . . . . . . . . . . . . . . . . . . . . . . 8
Data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Device addressing . . . . . . . . . . . . . . . . . . . . . . 9
Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
DC-to-DC converter . . . . . . . . . . . . . . . . . . . . 12
Capacitive configuration . . . . . . . . . . . . . . . . . 12
Inductive configuration . . . . . . . . . . . . . . . . . . 13
V
Sequencer and clock counter . . . . . . . . . . . . . 13
Activation sequence . . . . . . . . . . . . . . . . . . . . 13
Deactivation sequence . . . . . . . . . . . . . . . . . . 15
Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Introduction to soldering . . . . . . . . . . . . . . . . . 27
Wave and reflow soldering . . . . . . . . . . . . . . . 27
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 27
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 28
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 31
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
2
2
CC
C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
C-bus protocol . . . . . . . . . . . . . . . . . . . . . . . . 8
buffer . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
16.4
17
18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Contact information . . . . . . . . . . . . . . . . . . . . 31
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Low power IC card interface
Document identifier: TDA8023_1
TDA8023
Date of release: 16 July 2007
All rights reserved.