MT29C4G96MAZAPCJA-5 IT Micron Technology Inc, MT29C4G96MAZAPCJA-5 IT Datasheet - Page 14

• Manufacturer Part Number: MT29C4G96MAZAPCJA-5 IT
• Description: MICMT29C4G96MAZAPCJA-5_IT 4G+4G MCP 137B
• Manufacturer: Micron Technology Inc

Figure 9:
PDF: 09005aef8326e5ac / Source: 09005aef8326e59a
152ball_ nand_lpdram_j4xx_omap.fm - Rev. E 4/09 EN
Solder ball
material: SAC105.
Dimensions apply
to solder balls post-
reflow on Ø0.35
SMD ball pads.
Preliminary: This data sheet contains initial characterization limits that are subject to change upon full characterization of production
152X Ø0.45
Seating
plane
13 CTR
0.12 A
0.65 TYP
152-Ball TFBGA (Package Code: JQ)
A
21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
Notes: 1. All dimensions are in millimeters.
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8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
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All other trademarks are the property of their respective owners.
14 ±0.1
13 CTR
152-Ball NAND Flash and Mobile LPDRAM PoP (TI OMAP) MCP
Ball A1 ID
0.65 TYP
devices.
14
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
T
U
V
W
X
0.75 ±0.1
14 ±0.1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
0.35 MIN
1.1 MAX
Ball A1 ID
Package Dimensions
©2008 Micron Technology, Inc. All rights reserved.
Preliminary