STEVAL-ISA044V6 STMicroelectronics, STEVAL-ISA044V6 Datasheet - Page 15

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STEVAL-ISA044V6

Manufacturer Part Number
STEVAL-ISA044V6
Description
BOARD & REF DESIGN
Manufacturer
STMicroelectronics
Series
-r
Datasheet

Specifications of STEVAL-ISA044V6

Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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0
ST1S10
Figure 7.
6.1
PCB layout suggestion
Thermal considerations
The lead frame die pad, of ST1S10, is exposed at the bottom of the package and must be
soldered directly to a properly designed thermal pad on the PCB, the addition of thermal
vias from the thermal pad to an internal ground plane will help increase power dissipation.
Power Ground
Power Ground
Doc ID 13844 Rev 4
I
I
IN
IN
Common ground node
Common ground node
Common ground node
for power ground
for power ground
for power ground
Layout considerations
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