MT46H8M16LFBF-6:K Micron Technology Inc, MT46H8M16LFBF-6:K Datasheet - Page 16

• Manufacturer Part Number: MT46H8M16LFBF-6:K
• Description: IC SDRAM 128MB 166MHZ 60VFBGA
• Manufacturer: Micron Technology Inc
• Type: DDR SDRAMr
• Series: -r

Specifications of MT46H8M16LFBF-6:K

• Organization: 8Mx16
• Density: 128Mb
• Address Bus: 15b
• Access Time (max): 6.5/5ns
• Maximum Clock Rate: 166MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 80mA
• Pin Count: 60
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Format - Memory: RAM
• Memory Type: Mobile DDR SDRAM
• Memory Size: 128M (8Mx16)
• Speed: 166MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.95 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 60-VFBGA
• Lead Free Status / Rohs Status: Compliant

Figure 7: 90-Ball VFBGA (8mm x 13mm), Package code: B5
PDF: 09005aef8331b3e9
128mb_mobile_ddr_sdram_t35m.pdf - Rev. F 03/10 EN
Dimensions apply
to solder balls post-
reflow. Pre-reflow
balls are Ø0.42 on
Ø0.4 SMD ball pads.
Seating
90X Ø0.45
plane
0.1 A
11.2
0.8 TYP
5.6
Note:
A
9
8
1. All dimensions are in millimeters.
3.2
7
8 ±0.1
6.4
Ball A1 ID
4 ±0.05
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
6.5 ±0.05
0.65 ±0.05
0.8 TYP
16
13 ±0.1
128Mb: x16, x32 Mobile LPDDR SDRAM
1.0 MAX
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Solder ball material:
Substrate material: plastic laminate
Mold compound: epoxy novolac
SAC105 (98.5% Sn, 1%Ag, 0.5% Cu)
Package Dimensions
Ball A1 ID
© 2007 Micron Technology, Inc. All rights reserved.