DS21348G Maxim Integrated Products, DS21348G Datasheet - Page 63

IC LIU T1/E1/J1 3.3V 49-BGA

DS21348G

Manufacturer Part Number
DS21348G
Description
IC LIU T1/E1/J1 3.3V 49-BGA
Manufacturer
Maxim Integrated Products
Type
Line Interface Units (LIUs)r
Datasheet

Specifications of DS21348G

Number Of Drivers/receivers
1/1
Protocol
T1/E1/J1
Voltage - Supply
3.135 V ~ 3.465 V
Mounting Type
Surface Mount
Package / Case
49-CSBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

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10.
Table 10-1. Thermal Characteristics—DS21Q348 CSBGA Package
Ambient Temperature
Junction Temperature
Theta-JA (θ
Theta-JC (θ
NOTES:
1) The package is mounted on a four-layer JEDEC-standard test board.
2) Theta-JA (θ
3) While Theta-JC (θ
Table 10-2. Theta-JA (θ
FORCED AIR (m/s)
layer JEDEC-standard test board.
junction temperature (T
packages (T
The method of measurement of the thermal parameters is defined in EIA/JEDEC-standard document
EIA-JESD51-2.
THERMAL CHARACTERISTICS
PARAMETER
2.5
0
1
JC
JA
) in Still Air
) in Still Air
JA
C
), the proper term is Psi-JT. It is defined by:
) is the junction to ambient thermal resistance, when the package is mounted on a four-
JC
) is commonly used as the thermal parameter that provides a correlation between the
j
) and the average temperature on top center of four of the chip-scale BGA
THETA-JA (θ
(T
JA
J
- T
) vs. Airflow
24ºC/W
21ºC/W
19ºC/W
C
) / overall package power
-40ºC
MIN
JA
)
63 of 76
+4.1ºC/W
+24ºC/W
TYP
+125ºC
+85ºC
MAX
NOTES
1
2
3

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