PSMN2R2-30YLC,115 NXP Semiconductors, PSMN2R2-30YLC,115 Datasheet - Page 8

MOSFET Power N-Ch 30V 2.15mOhms

PSMN2R2-30YLC,115

Manufacturer Part Number
PSMN2R2-30YLC,115
Description
MOSFET Power N-Ch 30V 2.15mOhms
Manufacturer
NXP Semiconductors
Series
-r
Datasheet

Specifications of PSMN2R2-30YLC,115

Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
2.15 mOhms
Drain-source Breakdown Voltage
30 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
100 A
Power Dissipation
141 W
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Package / Case
LFPAK
Gate Charge Qg
55 nC
Minimum Operating Temperature
- 55 C
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
2.15 mOhm @ 25A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
100A
Vgs(th) (max) @ Id
1.95V @ 1mA
Gate Charge (qg) @ Vgs
55nC @ 10V
Input Capacitance (ciss) @ Vds
3310pF @ 15V
Power - Max
141W
Mounting Type
Surface Mount
Lead Free Status / Rohs Status
 Details
Other names
934065191115
NXP Semiconductors
PSMN2R2-30YLC
Product data sheet
Fig 8.
Fig 10. Sub-threshold drain current as a function of
(A)
I
(S )
g
10
D
10
10
10
10
10
200
160
120
fs
80
40
-1
-2
-3
-4
-5
-6
0
drain current; typical values
gate-source voltage
Forward transconductance as a function of
0
0
20
Min
1
40
Typ
60
Max
2
N-channel 30 V 2.15mΩ logic level MOSFET in LFPAK using NextPower
V
80
All information provided in this document is subject to legal disclaimers.
003a a f 893
003a a f 894
GS
I
D
(V)
(A)
100
3
Rev. 02 — 3 May 2011
Fig 9.
Fig 11. Gate-source threshold voltage as a function of
(A)
V
I
D
GS (th)
(V)
100
80
60
40
20
3
2
1
0
0
-60
function of gate-source voltage; typical values
junction temperature
Transfer characteristics; drain current as a
0
Max (1mA)
Min (5mA)
T
0
1
PSMN2R2-30YLC
j
= 150°C
I
D
=5mA
60
2
1mA
T
j
120
= 25 °C
3
© NXP B.V. 2011. All rights reserved.
003a a f 896
003a a f 892
V
T
GS
j
(°C)
(V)
180
4
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