M95256-WMN3TP/AB STMicroelectronics, M95256-WMN3TP/AB Datasheet - Page 42

• Manufacturer Part Number: M95256-WMN3TP/AB
• Manufacturer: STMicroelectronics

Part numbering
11
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Part numbering
Table 26.
1. ST strongly recommends the use of the Automotive Grade devices for use in an automotive environment.
2. Used only for device grade 3 and WLCSP packages.
For a list of available options (speed, package, etc.) or for further information on any aspect
of this device, please contact your nearest ST Sales Office. The category of second-level
interconnect is marked on the package and on the inner box label, in compliance with
JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label.
Example:
Device type
M95 = SPI serial access EEPROM
Device function
256 = 256 Kbit
256-D = 256 Kbit plus Identification page
Operating voltage
blank = V
W = V
R = V
Package
MN = SO8 (150 mils width)
DW = TSSOP8 (169 mils width)
CS = WLCSP
MB or MC = UFDFPN8 (MLP8)
Device grade
6 = Industrial temperature range, –40 to 85 °C. Device tested with standard test flow
3 = Device tested with High Reliability Certified Flow
Automotive temperature range (–40 to 125 °C)
Option
blank = Standard packing
T = Tape and reel packing
Plating technology
P or G = ECOPACK
Process
A or AB = F8L
K = F8H
The High Reliability Certified Flow (HRCF) is described in the quality note QNEE9801. Please ask your
nearest ST sales office for a copy.
CC
CC
= 1.8 to 5.5 V
CC
= 2.5 to 5.5 V
= 4.5 to 5.5 V
Ordering information scheme
(2)
®
(RoHs compliant)
Doc ID 12276 Rev 17
M95256-DR, M95256, M95256-W, M95256-R
M95256
(1)
–
W MN 6
T
P
/A