BD3508MUV-E2 Rohm Semiconductor, BD3508MUV-E2 Datasheet - Page 18

• Manufacturer Part Number: BD3508MUV-E2
• Description: IC REG LDO N-CH FET ULT LO 20QFN
• Manufacturer: Rohm Semiconductor
• Series: -r

Specifications of BD3508MUV-E2

• Regulator Topology: Positive Adjustable
• Voltage - Output: 0.65 V ~ 2.7 V
• Voltage - Input: 0.75 V ~ 5.5 V
• Voltage - Dropout (typical): 0.065 @ 1A
• Number Of Regulators: 1
• Current - Output: 3A (Min)
• Current - Limit (min): -
• Operating Temperature: -10°C ~ 100°C
• Mounting Type: Surface Mount
• Package / Case: 20-VFQFN Exposed Pad
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

●Operation Notes
© 2010 ROHM Co., Ltd. All rights reserved.
BD3508MUV,BD3509MUV
www.rohm.com
10. Testing on application boards
1. Absolute maximum ratings
2. Connecting the power supply connector backward
3. Output pin
4. GND voltage
5. Thermal design
6. Inter-pin shorts and mounting errors
7. Actions in strong electromagnetic field
8. ASO
9. Thermal shutdown circuit
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any
over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as
fuses.
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply
lines. An external direction diode can be added.
In the event that load containing a large inductance component is connected to the output terminal, and generation of
back-EMF at the start-up and when output is turned OFF is assumed, it is requested to insert a protection diode.
The potential of GND pin must be minimum potential in all operating conditions.
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is
designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation.
Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit
is assumed.
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or
removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic
measure. Use similar precaution when transporting or storing the IC.
BD3508MUV /
BD3509MUV
(Example)
OUTPUT PIN
TSD on temperature [°C] (typ.)
175
18/20
Hysteresis temperature [°C] (typ.)
15
2010.04 - Rev.C
Technical Note