UJA1065TW/3V0,512 NXP Semiconductors, UJA1065TW/3V0,512 Datasheet - Page 68

• Manufacturer Part Number: UJA1065TW/3V0,512
• Description: IC CAN/LIN FAIL-SAFE 32HTSSOP
• Manufacturer: NXP Semiconductors

Specifications of UJA1065TW/3V0,512

• Applications: Automotive Networking
• Interface: SPI
• Voltage - Supply: 5.5 V ~ 52 V
• Package / Case: 32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935281289512; UJA1065TW/3V0; UJA1065TW/3V0

NXP Semiconductors
12. Package outline
Fig 29. Package outline SOT549-1 (HTSSOP32)
UJA1065_7
Product data sheet
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
E h
VERSION
OUTLINE
SOT549-1
max.
32
1.1
1
A
Z
y
pin 1 index
0.15
0.05
A 1
0.95
0.85
A 2
IEC
0.25
A 3
exposed die pad side
e
0.30
0.19
b p
D h
D
0.20
0.09
c
MO-153
JEDEC
11.1
10.9
D
(1)
REFERENCES
Rev. 07 — 25 February 2010
0
D h
5.1
4.9
E
6.2
6.0
b
(2)
p
JEITA
scale
17
16
2.5
E h
3.6
3.4
w
c
High-speed CAN/LIN fail-safe system basis chip
M
0.65
e
A 2
5 mm
A 1
H E
8.3
7.9
L
1
0.75
0.50
L p
H E
E
PROJECTION
detail X
EUROPEAN
0.2
v
L
L
p
0.1
w
UJA1065
© NXP B.V. 2010. All rights reserved.
(A 3 )
0.1
y
A
ISSUE DATE
03-04-07
05-11-02
0.78
0.48
θ
X
Z
SOT549-1
A
v
M
8
0
θ
o
o
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A