UJA1065TW/3V0,512 NXP Semiconductors, UJA1065TW/3V0,512 Datasheet - Page 71

• Manufacturer Part Number: UJA1065TW/3V0,512
• Description: IC CAN/LIN FAIL-SAFE 32HTSSOP
• Manufacturer: NXP Semiconductors

Specifications of UJA1065TW/3V0,512

• Applications: Automotive Networking
• Interface: SPI
• Voltage - Supply: 5.5 V ~ 52 V
• Package / Case: 32-TSSOP Exposed Pad, 32-eTSSOP, 32-HTSSOP
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935281289512; UJA1065TW/3V0; UJA1065TW/3V0

NXP Semiconductors
UJA1065_7
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
Fig 30. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
Rev. 07 — 25 February 2010
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
High-speed CAN/LIN fail-safe system basis chip
temperature
peak
UJA1065
© NXP B.V. 2010. All rights reserved.
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