KIT_TC1793_SK Infineon Technologies, KIT_TC1793_SK Datasheet - Page 6

• Manufacturer Part Number: KIT_TC1793_SK
• Description: KIT STARTER AUDO MAX TC1793
• Manufacturer: Infineon Technologies
• Series: AUDOMAXr
• Type: MCUr

Specifications of KIT_TC1793_SK

• Contents: Board, Adapters, Cables, CD, Power Supply
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: TC1793
• Other names: KITTC1793SKIN

Application Note
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1. Supply Pins (Modules)
2. I/O-Pins
3. Output Pins including LVDS
4.Input Pins without internal pull
device
5. Input Pins with internal pull
device
Route these signals with adjacent ground reference and avoid signal and reference layer changes.
Route them as short as possible.
Routing ground on each side can help to reduce coupling to other signals.
- Separate analog and digital grounds.
- The analog ground must be separated into two groups:
For unused “Output, Supply, Input and I/O “ pins following points must be considered:
The ground system must be designed as follows:
To reduce the radiation / coupling from the oscillator circuit, a separated ground island on the GND
layer should be made. This ground island can be connected at one point to the GND layer. This helps to
keep noise generated by the oscillator circuit locally on this separated island. The ground connections
of the load capacitors and VSSOSC should also be connected to this island. Traces for the load
capacitors and Xtal should be as short as possible.
common star point.
2. Ground for ADC (VSSM for VDDM, VSSMF for VDDMF/VDDAF) as common star point.
1. Ground for OSC and PLL (VSSOSC for VDDOSC, VDDOSC3, VDDPF and VDDPF3) as
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ERAY Pins
Supply Pins
See the User´s Manual.
Should be configured as output and driven to static low in the
weakest driver mode in order to improve EMI behaviour.
Confuguration of the I/O as input with pullup is also possible.
Solderpad should be left open and not be connected to any
other net (layout isolated PCB-pad only for soldering).
Should be driven static in the weakest driver mode.
If static output level is not possible, the output driver should
be disabled.
Solderpad should be left open and not be connected to any
other net (layout isolated PCB-pad only for soldering).
For pins with alternate function see product target
specification to define the necessary logic level.
Should be connected with high-ohmic resistor to GND (range
10k – 1Meg) wherever possible. No impact on design is
however expected if a direct connection to GND is made.
Groups of 8 pins can be used to reduce number of external
pull-up/down devices (keep in mind leakage current).
For pins with alternate function see product specification to
define the necessary logic level
Should be configured as pull-down and should be activated
static low (exception: if the User´s Manual requires high level
for alternate functions). No impact on design is expected if
static high level is activated.
Solderpad should not be connected to any other net (isolated
PCB-pad only for soldering)
Design Guideline for TC1793 Microcontroller Board Layout
6
PCB Design Recommendations
V1.0, 2010-04
AP32163