BLKD815EPFVU Intel, BLKD815EPFVU Datasheet - Page 85
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BLKD815EPFVU
Manufacturer Part Number
BLKD815EPFVU
Description
Manufacturer
Intel
Datasheet
1.BLKD815EPFVU.pdf
(145 pages)
Specifications of BLKD815EPFVU
Lead Free Status / Rohs Status
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2.10.2 I/O Shields
✏
The back panel I/O shields for the D815EFV and D815EPFV boards must meet specific dimension
and material requirements. Systems based on this board need the back panel I/O shield to pass
emissions (EMI) certification testing. Figure 19, Figure 20, and Figure 21 show the critical
dimensions of the chassis-dependent I/O shield for the Universal boards. Figure 22, Figure 23, and
Figure 24 show the critical dimensions of the chassis-dependent I/O shield for earlier versions of
the boards. Dimensions are given in inches [millimeters], to a tolerance of ± 0.020 inches
[0.508 millimeters].
These figures also indicate the position of each cutout. Additional design considerations for I/O
shields relative to chassis requirements are described in the ATX specification.
NOTE
An I/O shield compliant with the ATX chassis specification 2.03 is available from Intel.
For information about
The ATX specification
The microATX specification
How to identify a Universal D815EFV / D815EPFV board
Refer to
Table 4, page 18
Table 4, page 18
Section 1.1.2, page 12
Technical Reference
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