BUK9509-40B NXP Semiconductors, BUK9509-40B Datasheet - Page 5

MOSFET Power HIGH PERF TRENCHMOS

BUK9509-40B

Manufacturer Part Number
BUK9509-40B
Description
MOSFET Power HIGH PERF TRENCHMOS
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BUK9509-40B

Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.007 Ohms
Drain-source Breakdown Voltage
40 V
Gate-source Breakdown Voltage
+/- 15 V
Continuous Drain Current
95 A
Power Dissipation
157 W
Maximum Operating Temperature
+ 175 C
Mounting Style
Through Hole
Package / Case
TO-220AB
Fall Time
89 ns
Minimum Operating Temperature
- 55 C
Rise Time
106 ns
Lead Free Status / Rohs Status
 Details
Other names
BUK9509-40B,127

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NXP Semiconductors
5. Thermal characteristics
Table 5.
BUK9509-40B
Product data sheet
Symbol
R
R
Fig 4.
th(j-mb)
th(j-a)
Transient thermal impedance from junction to mounting base as a function of pulse duration
Thermal characteristics
Parameter
thermal resistance
from junction to
mounting base
thermal resistance
from junction to
ambient
Z
(K/W)
th(j-mb)
10
10
10
−1
−2
−3
1
10
−6
δ = 0.5
single shot
0.05
0.02
0.2
0.1
10
−5
Conditions
see
vertical in still air
All information provided in this document is subject to legal disclaimers.
Figure 4
10
−4
Rev. 02 — 14 June 2010
10
−3
10
−2
N-channel TrenchMOS logic level FET
P
10
t
−1
p
T
t
p
BUK9509-40B
Min
-
-
(s)
δ =
03nm66
t
T
t
p
1
Typ
-
60
© NXP B.V. 2010. All rights reserved.
Max
0.95
-
Unit
K/W
K/W
5 of 14

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