CY7C25702KV18-550BZXI Cypress Semiconductor Corp, CY7C25702KV18-550BZXI Datasheet - Page 11
CY7C25702KV18-550BZXI
Manufacturer Part Number
CY7C25702KV18-550BZXI
Description
IC SRAM DDR-II+ CIO-ODT 165FBGA
Manufacturer
Cypress Semiconductor Corp
Datasheet
1.CY7C25702KV18-550BZXI.pdf
(29 pages)
Specifications of CY7C25702KV18-550BZXI
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CY7C25702KV18-550BZXI
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Part Number:
CY7C25702KV18-550BZXI
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
20 000
Truth Table
The truth table for the CY7C25662KV18, CY7C25772KV18, CY7C25682KV18, and CY7C25702KV18 follow.
Write Cycle Descriptions
The write cycle description table for CY7C25662KV18 and CY7C25682KV18 follows.
Document Number: 001-66483 Rev. **
Write Cycle:
Load address; wait one cycle;
input write data on consecutive K and K rising edges.
Read Cycle: (2.5 cycle Latency)
Load address; wait two and half cycles;
read data on consecutive K and K rising edges.
NOP: No Operation
Standby: Clock Stopped
Notes
BWS
NWS
4. X = “Don’t Care,” H = Logic HIGH, L = Logic LOW,
5. Device powers up deselected with the outputs in a tri-state condition.
6. “A” represents address location latched by the devices when transaction was initiated. A + 1 represents the address sequence in the burst.
7. “t” represents the cycle at which a read/write operation is started. t + 1 and t + 2 are the first and second clock cycles succeeding the “t” clock cycle.
8. Data inputs are registered at K and K rising edges. Data outputs are delivered on K and K rising edges as well.
9. It is recommended that K = K = HIGH when clock is stopped. This is not essential, but permits most rapid restart by overcoming transmission line charging symmetrically
10. Is based on a write cycle that was initiated in accordance with
H
H
H
H
L
L
L
L
cycle, as long as the setup and hold requirements are achieved.
0
0
/
BWS
NWS
H
H
H
H
L
L
L
L
1
1
/
L–H
L–H
L–H
L–H
K
–
–
–
–
Operation
L–H During the data portion of a write sequence
L–H During the data portion of a write sequence
L–H No data is written into the devices during this portion of a write operation.
L-H During the data portion of a write sequence
K
–
–
–
–
During the data portion of a write sequence
CY7C25662KV18 both nibbles (D
CY7C25682KV18 both bytes (D
CY7C25662KV18 both nibbles (D
CY7C25682KV18 both bytes (D
During the data portion of a write sequence
CY7C25662KV18 only the lower nibble (D
CY7C25682KV18 only the lower byte (D
CY7C25662KV18 only the lower nibble (D
CY7C25682KV18 only the lower byte (D
During the data portion of a write sequence
CY7C25662KV18 only the upper nibble (D
CY7C25682KV18 only the upper byte (D
CY7C25662KV18 only the upper nibble (D
CY7C25682KV18 only the upper byte (D
No data is written into the devices during this portion of a write operation.
represents rising edge.
Table
. NWS
Stopped
L-H
L-H
L-H
K
0
, NWS
[17:0]
[17:0]
[7:0]
[7:0]
1
, BWS
) are written into the device.
) are written into the device.
) are written into the device.
) are written into the device.
LD
H
X
CY7C25662KV18, CY7C25772KV18
CY7C25682KV18, CY7C25702KV18
L
L
[8:0]
[8:0]
[17:9]
[17:9]
0
, BWS
[3:0]
[3:0]
Comments
[7:4]
[7:4]
) is written into the device, D
) is written into the device, D
) is written into the device, D
) is written into the device, D
) is written into the device, D
) is written into the device, D
) is written into the device, D
) is written into the device, D
1
, BWS
R/W
H
X
X
L
2
[4, 10]
, and BWS
D(A) at K(t + 1)
Q(A) at K(t + 2)
High Z
Previous State
3
can be altered on different portions of a write
DQ
[17:9]
[17:9]
[8:0]
[8:0]
[7:4]
[7:4]
[3:0]
[3:0]
[4, 5, 6, 7, 8, 9]
remains unaltered.
remains unaltered.
remains unaltered.
remains unaltered.
remains unaltered.
remains unaltered.
remains unaltered.
remains unaltered.
D(A+1) at K(t + 1)
Q(A+1) at K(t + 3)
High Z
Previous State
Page 11 of 29
DQ
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