LM3208TL/NOPBPB National Semiconductor, LM3208TL/NOPBPB Datasheet

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... Only three small external surface-mount components, an inductor and two ceramic capacitors, are required. Typical Application © 2006 National Semiconductor Corporation Features n 2 MHz (typ.) PWM Switching Frequency n Operates from a single Li-Ion cell (2.7V to 5.5V) n Adjustable Output Voltage (0.8V to 3.6V) n Fast Output Voltage Transient (0.8V to 3.4V in 25µ ...

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Connection Diagrams Order Information Order Number LM3208TL LM3208TLX Note: The actual physical placement of the package marking will vary from part to part. The package marking “X” designates the date code. “V” NSC internal code for die traceability. ...

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... Absolute Maximum Ratings If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications SGND DD IN PGND to SGND EN, FB, V CON Continuous Power Dissipation (Note 3) Junction Temperature (T ) J-MAX Storage Temperature Range Maximum Lead Temperature (Soldering, 10 sec) Electrical Characteristics face type apply over the full operating ambient temperature range (− ...

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System Characteristics values in the typical application circuit are used (L = 3.0µH, DCR = 0.12Ω, FDK MIPW3226D3R0M; C TDK C2012X5R0J106K 4.7µF, 6.3V, 0603, TDK C1608X5R0J475M). These parameters are not guaranteed by OUT production testing. Min and Max ...

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... Refer to System Characteristics table for maximum output current. Note 12: Ripple voltage should be measured at C Note 13: National Semiconductor recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper ESD handling procedures can result in damage. ± ...

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Typical Performance Characteristics unless otherwise specified.). Quiescent Current vs Supply Voltage ( 0V, No Switching) CON Switching Frequency vs Temperature (V = 1.3V 200mA) OUT OUT Output Voltage vs Temperature (V = 3.6V, V ...

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Typical Performance Characteristics unless otherwise specified.). (Continued) Current Limit vs Temperature (Large PFET) V Voltage vs Output Voltage CON = 10 Ω) (R LOAD Efficiency vs Output Voltage (V = 3.9V) IN (Circuit in Figure Current Limit ...

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Typical Performance Characteristics unless otherwise specified.). (Continued) Efficiency vs Output Current (V = 0.8V) OUT Efficiency vs Output Current (R Management) DSON Dark curves are efficiency profiles of either large PFET or small PFET whichever is higher Temperature ...

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Typical Performance Characteristics unless otherwise specified.). (Continued Temperature DSON (N-ch -200mA) SW Load Transient Response (V = 0.8V) OUT Startup = 3.6V 1.3V OUT LOAD (Circuit in Figure ...

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Typical Performance Characteristics unless otherwise specified.). (Continued) Shutdown Response (V = 4.2V 3.4V OUT V Transient Response CON (V = 4.2V 0.32V/1.44V CON Output Voltage Ripple (V = 1.3V) OUT www.national.com (Circuit ...

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Typical Performance Characteristics unless otherwise specified.). (Continued) Output Voltage Ripple in Pulse Skip (V = 3.96V 3.4V OUT (Circuit in Figure 5Ω) LOAD 20166337 3.6V and T ...

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Block Diagram Operation Description The LM3208 is a simple, step-down DC-DC converter opti- mized for powering RF power amplifiers (PAs) in mobile phones, portable communicators, and similar battery pow- ered RF devices designed to allow the RF PA ...

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Operation Description Circuit Operation Referring to Figure 1 and Figure 2, the LM3208 operates as follows. During the first part of each switching cycle, the control block in the LM3208 turns on the internal PFET (P-channel MOSFET) switch. This allows ...

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R Management DSON(P) device uses only a small part of the PFET to minimize drive loss of the PFET. When V is greater than 0.42V (typ.), CON the entire PFET is used to minimize R threshold has about 20mV (typ.) ...

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... Micro SMD PACKAGE ASSEMBLY AND USE Use of the Micro SMD package requires specialized board layout, precision mounting and careful re-flow techniques, as detailed in National Semiconductor Application Note 1112. Refer to the section Surface Mount Technology (SMD) As- sembly Considerations. For best results in assembly, align- ment ordinals on the PC board should be used to facilitate placement of the device ...

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Application Information The LM3208 converts higher input voltage to lower output voltage with high efficiency. This is achieved with an inductor-based switching topology. During the first half of the switching cycle, the internal PMOS switch turns on, the input voltage ...

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