MT46H4M32LFB5-5:K TR Micron Technology Inc, MT46H4M32LFB5-5:K TR Datasheet - Page 15
![](/photos/31/34/313421/mfg557-90-vfbga_sml.jpg)
MT46H4M32LFB5-5:K TR
Manufacturer Part Number
MT46H4M32LFB5-5:K TR
Description
Manufacturer
Micron Technology Inc
Type
DDR SDRAMr
Datasheet
1.MT46H4M32LFB5-5K_TR.pdf
(94 pages)
Specifications of MT46H4M32LFB5-5:K TR
Organization
4Mx32
Density
128Mb
Address Bus
14b
Access Time (max)
6.5/5ns
Maximum Clock Rate
200MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.95V
Operating Supply Voltage (min)
1.7V
Supply Current
110mA
Pin Count
90
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Compliant
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Package Dimensions
Figure 6: 60-Ball VFBGA (8mm x 9mm), Package code: BF
PDF: 09005aef8331b3e9
128mb_mobile_ddr_sdram_t35m.pdf - Rev. F 03/10 EN
Dimensions apply
to solder balls
post-reflow. The
pre-reflow balls are
Ø0.42 on Ø0.4 SMD
ball pads.
Seating
plane
60x Ø0.45
7.2
0.1 A
0.8 TYP
0.8 TYP
3.6
Note:
A
9
8
1. All dimensions are in millimeters.
7
8 ±0.1
6.4
3.2
4 ±0.05
3
2
1
A
B
C
D
E
F
G
H
J
K
4.5 ±0.05
0.65 ±0.05
15
Ball A1 ID
0.3 ±0.025
128Mb: x16, x32 Mobile LPDDR SDRAM
9 ±0.1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1.0 MAX
Mold compound: epoxy novolac
Solder ball material:
Substrate material: plastic laminate
SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)
Package Dimensions
© 2007 Micron Technology, Inc. All rights reserved.
Micron logo
to be lased
ball A1 ID
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