PCF8584P NXP Semiconductors, PCF8584P Datasheet - Page 35

• Manufacturer Part Number: PCF8584P
• Manufacturer: NXP Semiconductors

Specifications of PCF8584P

• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Operating Temperature (max): 85C
• Package Type: PDIP
• Rad Hardened: No
• Lead Free Status / Rohs Status: Compliant

Philips Semiconductors
15 PACKAGE OUTLINES
1997 Oct 21
DIP20: plastic dual in-line package; 20 leads (300 mil)
I
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2
inches
UNIT
C-bus controller
mm
SOT146-1
L
OUTLINE
VERSION
max.
Z
0.17
4.2
A
20
1
pin 1 index
0.020
min.
0.51
A
1
IEC
max.
0.13
3.2
A
2
0.068
0.051
1.73
1.30
b
e
0.021
0.015
0.53
0.38
JEDEC
b
D
1
REFERENCES
0
0.014
0.009
0.36
0.23
c
b
26.92
26.54
1.060
1.045
D
(1)
SC603
scale
EIAJ
35
5
6.40
6.22
0.25
0.24
E
(1)
2.54
0.10
11
10
b
e
1
10 mm
7.62
0.30
w
A
e
1
1
M
A
E
2
3.60
3.05
0.14
0.12
L
A
PROJECTION
EUROPEAN
8.25
7.80
0.32
0.31
M
E
c
10.0
0.39
0.33
M
8.3
Product specification
H
(e )
M
M
1
H
E
PCF8584
ISSUE DATE
0.254
0.01
92-11-17
95-05-24
w
SOT146-1
max.
0.078
2.0
Z
(1)