PCF8584P NXP Semiconductors, PCF8584P Datasheet - Page 36

• Manufacturer Part Number: PCF8584P
• Manufacturer: NXP Semiconductors

Specifications of PCF8584P

• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Operating Temperature (max): 85C
• Package Type: PDIP
• Rad Hardened: No
• Lead Free Status / Rohs Status: Compliant

Philips Semiconductors
SO20: plastic small outline package; 20 leads; body width 7.5 mm
1997 Oct 21
I
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
inches
2
UNIT
mm
C-bus controller
OUTLINE
VERSION
SOT163-1
max.
0.10
2.65
A
20
1
Z
y
0.012
0.004
0.30
0.10
A
1
pin 1 index
0.096
0.089
2.45
2.25
A
2
075E04
IEC
0.25
0.01
e
A
3
D
0.019
0.014
0.49
0.36
b
p
MS-013AC
0.013
0.009
0.32
0.23
JEDEC
c
0
REFERENCES
b
13.0
12.6
0.51
0.49
D
p
(1)
11
10
0.30
0.29
E
w
7.6
7.4
(1)
M
scale
0.050
EIAJ
1.27
36
5
e
c
0.419
0.394
10.65
10.00
H
E
A
2
0.055
A
1.4
L
1
10 mm
0.043
0.016
1.1
0.4
L
p
H
E
E
detail X
0.043
0.039
1.1
1.0
Q
L
PROJECTION
L
EUROPEAN
p
0.25
0.01
Q
v
(A )
3
0.01
0.25
w
A
Product specification
A
0.004
0.1
y
X
PCF8584
v
ISSUE DATE
M
95-01-24
97-05-22
0.035
0.016
Z
0.9
0.4
A
(1)
SOT163-1
8
0
o
o