TDA8601 NXP Semiconductors, TDA8601 Datasheet - Page 20
TDA8601
Manufacturer Part Number
TDA8601
Description
Manufacturer
NXP Semiconductors
Datasheet
1.TDA8601.pdf
(20 pages)
Specifications of TDA8601
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TDA8601
Manufacturer:
PHILIPS
Quantity:
474
Company:
Part Number:
TDA8601/C2
Manufacturer:
PHILIPS
Quantity:
199
Part Number:
TDA8601T
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Company:
Part Number:
TDA8601T/C1
Manufacturer:
SEK
Quantity:
1 670
Part Number:
TDA8601T/C1
Manufacturer:
PHILIPS/飞利浦
Quantity:
20 000
Philips Semiconductors
22. Contents
1
2
3
4
5
6
7
7.1
7.2
8
9
10
11
11.1
11.2
12
13
14
15
15.1
15.2
15.2.1
15.2.2
15.3
15.3.1
15.3.2
15.3.3
15.4
16
17
18
19
20
21
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Thermal characteristics. . . . . . . . . . . . . . . . . . . 5
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Application information. . . . . . . . . . . . . . . . . . 11
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13
Handling information. . . . . . . . . . . . . . . . . . . . 15
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 19
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Contact information . . . . . . . . . . . . . . . . . . . . 19
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Operating characteristics . . . . . . . . . . . . . . . . . 5
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 6
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Through-hole mount packages . . . . . . . . . . . . 15
Soldering by dipping or by solder wave . . . . . 15
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 15
Surface mount packages . . . . . . . . . . . . . . . . 15
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 15
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 16
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 17
Package related soldering information . . . . . . 17
© Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Published in The Netherlands
RGB/YUV and fast blanking switch
Date of release: 23 September 2004
Document number: 9397 750 13713
TDA8601