LH28F800BGN-BL12 Sharp Electronics, LH28F800BGN-BL12 Datasheet

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LH28F800BGN-BL12

Manufacturer Part Number
LH28F800BGN-BL12
Description
Manufacturer
Sharp Electronics
Datasheet

Specifications of LH28F800BGN-BL12

Cell Type
NOR
Density
8Mb
Interface Type
Parallel
Boot Type
Bottom
Address Bus
19b
Operating Supply Voltage (typ)
3.3/5V
Operating Temp Range
0C to 70C
Package Type
SOP
Program/erase Volt (typ)
2.7/3.3/5/12V
Sync/async
Asynchronous
Operating Temperature Classification
Commercial
Operating Supply Voltage (min)
2.7/4.5V
Operating Supply Voltage (max)
3.6/5.5V
Word Size
16b
Number Of Words
512K
Supply Current
65mA
Mounting
Surface Mount
Pin Count
44
Lead Free Status / Rohs Status
Not Compliant
DESCRIPTION
The LH28F800BG-L flash memory with Smart
Voltage technology is a high-density, low-cost,
nonvolatile, read/write storage solution for a wide
range of applications. The LH28F800BG-L can
operate at V
voltage operation capability realizes longer battery
life and suits for cellular phone application. Its boot,
parameter and main-blocked architecture, flexible
voltage and enhanced cycling capability provide for
highly flexible component suitable for portable
terminals and personal computers. Its enhanced
suspend capabilities provide for an ideal solution for
code + data storage applications. For secure code
storage applications, such as networking, where
code is either directly executed out of flash or
downloaded to DRAM, the LH28F800BG-L offers
two levels of protection : absolute protection with
V
These alternatives give designers ultimate control of
their code security needs.
FEATURES
• SmartVoltage technology
• High performance read access time
• Enhanced automated suspend options
LH28F800BG-L
(FOR SOP)
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books,
etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
PP
– 2.7 V, 3.3 V or 5 V V
– 2.7 V, 3.3 V, 5 V or 12 V V
LH28F800BG-L85
– 85 ns (5.0±0.25 V)/90 ns (5.0±0.5 V)/
LH28F800BG-L12
– 120 ns (5.0±0.5 V)/130 ns (3.3±0.3 V)/
– Word write suspend to read
– Block erase suspend to word write
– Block erase suspend to read
at GND, selective hardware boot block locking.
100 ns (3.3±0.3 V)/120 ns (2.7 to 3.6 V)
150 ns (2.7 to 3.6 V)
CC
= 2.7 V and V
CC
PP
PP
= 2.7 V. Its low
- 1 -
• Enhanced data protection features
• SRAM-compatible write interface
• Optimized array blocking architecture
• Enhanced cycling capability
• Low power management
• Automated word write and block erase
• ETOX
• Package
ETOX is a trademark of Intel Corporation.
8 M-bit (512 kB x 16) SmartVoltage
– Absolute protection with V
– Block erase/word write lockout during power
– Boot blocks protection except RP# = V
– Two 4 k-word boot blocks
– Six 4 k-word parameter blocks
– Fifteen 32 k-word main blocks
– Top or bottom boot location
– 100 000 block erase cycles
– Deep power-down mode
– Automatic power saving mode decreases I
– Command user interface
– Status register
– 44-pin SOP (SOP044-P-0600)
transitions
in static mode
TM
V nonvolatile flash technology
LH28F800BG-L (FOR SOP)
Flash Memory
PP
= GND
HH
CC

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LH28F800BGN-BL12 Summary of contents

Page 1

... Its enhanced suspend capabilities provide for an ideal solution for code + data storage applications. For secure code storage applications, such as networking, where code is either directly executed out of flash or downloaded to DRAM, the LH28F800BG-L offers two levels of protection : absolute protection with V at GND, selective hardware boot block locking ...

Page 2

COMPARISON TABLE OPERATING VERSIONS TEMPERATURE LH28F800BG +70°C (FOR SOP) 1 LH28F800BG +70°C (FOR TSOP, CSP) 1 LH28F800BGH-L –40 to +85°C (FOR TSOP, CSP) 1 Refer to the datasheet of LH28F800BG-L/BGH-L (FOR TSOP, CSP). PIN CONNECTIONS DC ...

Page 3

BLOCK ORGANIZATION This product features an asymmetrically-blocked architecture providing system memory integration. Each erase block can be erased independently of the others up to 100 000 times. For the address locations of the blocks, see the memory map in Fig. ...

Page 4

... DEVICE POWER SUPPLY : Internal detection configures the device for 2 operation. To switch from one voltage to another, ramp V ramp V V SUPPLY CC attempts to the flash memory are inhibited. Device operations at invalid V (see Section 6.2.3 "DC CHARACTERISTICS") produce spurious results and should not be attempted. GND SUPPLY GROUND : Do not float any ground pins. ...

Page 5

... Writing memory data is performed in word increments of the device’s 32 k-word blocks typically within 8.4 µ µ consumes CC mode enables the system to read data from, or write . CC data to any other flash memory array location LH28F800BG-L (FOR SOP) at 2.7 V, 3.3 V and pin gives PP ≤ PPLK ...

Page 6

The boot block is located at either the top or the bottom of the address map accommodate different micro-processor protect for boot code location. The hardware-lockable boot block provides complete code security for the kernel code required for system initialization. ...

Page 7

Top Boot 7FFFF 4 k-Word Boot Block 7F000 7EFFF 4 k-Word Boot Block 7E000 7DFFF 4 k-Word Parameter Block 7D000 7CFFF 4 k-Word Parameter Block 7C000 7BFFF 4 k-Word Parameter Block 7B000 7AFFF 4 k-Word Parameter Block 7A000 79FFF 4 ...

Page 8

... Refer to Table 5 for write protection alternatives. 3 BUS OPERATION The local CPU reads and writes flash memory in- system. All bus cycles to or from the flash memory conform to standard microprocessor bus cycles. 3.1 Read Information can be read from any block, identifier codes or status register independent of the V voltage ...

Page 9

... IH command can be written. As with any automated device important to assert RP# during system reset. When the system -DQ ) comes out of reset, it expects to read from the flash 0 15 memory. Automated flash memories provide status information when accessed during block erase or IH word write modes CPU reset occurs with no ...

Page 10

The CUI does not occupy an addressable memory location written when WE# and CE# are active. The address and data needed to execute a command are latched on the ...

Page 11

BUS CYCLES COMMAND REQ Read Array/Reset Read Identifier Codes Read Status Register Clear Status Register Block Erase Word Write Block Erase and Word Write Suspend Block Erase and Word Write Resume NOTES : 1. Bus operations are defined in Table ...

Page 12

Read Array Command Upon initial device power-up and after exit from deep power-down mode, the device defaults to read array mode. This operation is also initiated by writing the Read Array command. The device remains enabled for reads until ...

Page 13

The CUI remains in read status register mode until a new command is issued. This two-step command sequence of set-up followed by execution ensures that block contents are not accidentally erased. An invalid Block Erase command sequence will result in ...

Page 14

... The only other valid commands while block erase is suspended are Read Status Register and Block Erase Resume. After a Block Erase Resume command is written to the flash memory, the WSM will continue the block erase process. Status register bits SR.6 and SR.7 will automatically clear ...

Page 15

WSMS ESS SR.7 = WRITE STATE MACHINE STATUS (WSMS Ready 0 = Busy SR.6 = ERASE SUSPEND STATUS (ESS Block Erase Suspended 0 = Block Erase in Progress/Completed SR.5 = ERASE STATUS ...

Page 16

Start Write 20H, Block Address Write D0H, Block Address Read Status Register Suspend Block No Erase Loop 0 Suspend SR.7 = Block Erase Yes 1 Full Status Check if Desired Block Erase Complete FULL STATUS CHECK PROCEDURE Read Status Register ...

Page 17

Start Write 40H or 10H, Address Write Word Data and Address Read Status Register Suspend Word No Write Loop 0 Suspend SR.7 = Word Write Yes 1 Full Status Check if Desired Word Write Complete FULL STATUS CHECK PROCEDURE Read ...

Page 18

Start Write B0H Read Status Register 0 SR Block Erase SR.6 = Completed 1 Read Read Word Write or Word Write? Read Array Data Word Write Loop No Done? Yes Write D0H Write FFH Block Erase Resumed ...

Page 19

Start Write B0H Read Status Register 0 SR Word Write SR.2 = Completed 1 Write FFH Read Array Data No Done Reading Yes Write D0H Write FFH Read Word Write Resumed Array Data Fig. 6 Word Write ...

Page 20

... GND. The bulk capacitor will overcome voltage slumps caused by PC board trace inductance. 5.4 V Trace on Printed Circuit Boards PP Updating flash memories that reside in the target system requires that the printed circuit board designers pay attention to the V trace. The V pin supplies the memory cell current PP for word writing and block erasing ...

Page 21

... When designing portable systems, designers must consider battery power consumption not only during device operation, but also for data retention during . LKO system idle time. Flash memory’s nonvolatility increases usable battery life because data is PP retained when system power is removed. In addition, deep power-down mode ensures extremely low power consumption even when system power is applied ...

Page 22

ELECTRICAL SPECIFICATIONS 6.1 Absolute Maximum Ratings Operating Temperature During Read, Block Erase and Word Write ............................. 0 to +70°C Temperature under Bias ............. –10 to +80°C Storage Temperature ........................ –65 to +125°C Voltage On Any Pin , and RP#) ...

Page 23

CAPACITANCE SYMBOL PARAMETER C Input Capacitance IN C Output Capacitance OUT NOTE : 1. Sampled, not 100% tested. 6.2.2 AC INPUT/OUTPUT TEST CONDITIONS 2.7 INPUT 0.0 AC test inputs are driven at 2.7 V for a Logic ...

Page 24

V 1N914 DEVICE UNDER TEST Includes Jig L Capacitance Fig. 10 Transient Equivalent Testing Load Circuit LH28F800BG-L (FOR SOP) Test Configuration Capacitance Loading Value TEST CONFIGURATION V = 3.3±0.3 V, 2.7 ...

Page 25

DC CHARACTERISTICS SYMBOL PARAMETER I Input Load Current LI I Output Leakage Current Standby Current CCS CC V Deep Power-Down CC I CCD Current I V Read Current CCR Word Write Current CCW ...

Page 26

DC CHARACTERISTICS (contd.) SYMBOL PARAMETER V Input Low Voltage IL V Input High Voltage IH V Output Low Voltage OL Output High Voltage V OH1 (TTL) Output High Voltage V OH2 (CMOS) V Lockout Voltage during PP V PPLK ...

Page 27

AC CHARACTERISTICS - READ-ONLY OPERATIONS V = 2 +70 • VERSIONS SYMBOL PARAMETER t Read Cycle Time AVAV t Address to Output Delay AVQV t CE# to Output Delay ELQV ...

Page 28

AC CHARACTERISTICS - READ-ONLY OPERATIONS (contd.) • 5.0±0.25 V, 5.0±0 VERSIONS SYMBOL PARAMETER t Read Cycle Time AVAV t Address to Output Delay AVQV t CE# to Output Delay ELQV t RP# High ...

Page 29

Standby V IH ADDRESSES ( CE# ( OE# ( WE# ( DATA (D/Q) High Z (DQ - ...

Page 30

AC CHARACTERISTICS - WRITE OPERATIONS V = 2 +70 • VERSIONS SYMBOL PARAMETER t Write Cycle Time AVAV t RP# High Recovery to WE# Going Low PHWL t CE# Setup ...

Page 31

AC CHARACTERISTICS - WRITE OPERATIONS (contd.) • 5.0±0.25 V, 5.0±0 VERSIONS SYMBOL PARAMETER t Write Cycle Time AVAV RP# High Recovery to WE# t PHWL Going Low t CE# Setup to WE# Going ...

Page 32

V IH ADDRESSES ( CE# ( ELWL V IH OE# ( WE# ( High Z DATA (D/ PHWL IL ...

Page 33

ALTERNATIVE CE#-CONTROLLED WRITES • 2 +70˚ VERSIONS SYMBOL PARAMETER t Write Cycle Time AVAV t RP# High Recovery to CE# Going Low PHEL t WE# Setup to CE# ...

Page 34

ALTERNATIVE CE#-CONTROLLED WRITES (contd.) • 5.0±0.25 V, 5.0±0 VERSIONS SYMBOL PARAMETER t Write Cycle Time AVAV RP# High Recovery to CE# t PHEL Going Low t WE# Setup to CE# Going Low WLEL ...

Page 35

V IH ADDRESSES ( WE# ( WLEL V IH OE# ( CE# ( High Z DATA (D/ PHEL IL ...

Page 36

RESET OPERATIONS V OH RY/BY# ( RP# ( RY/BY# ( RP# ( 2.7 V/3.3 V RP# ...

Page 37

BLOCK ERASE AND WORD WRITE PERFORMANCE • 2 +70˚ SYMBOL PARAMETER NOTE 32 k-Word t Word Write Block WHQV1 t Time 4 k-Word EHQV1 Block 32 k-Word Block ...

Page 38

BLOCK ERASE AND WORD WRITE PERFORMANCE (contd.) • 5.0 V±0.25 V, 5.0±0 SYMBOL PARAMETER t 32 k-Word Block WHQV1 Word Write Time t 4 k-Word Block EHQV1 32 k-Word Block Block Write Time 4 ...

Page 39

... B = Boot Block Power Supply Type G = SmartVoltage Technology Operating Temperature = OPTION ORDER CODE 1.35 V I/O Levels 1 LH28F800BGN-XL85 2 LH28F800BGN-XL12 - Access Speed (ns (5.0 0.25 V (5.0 0.5 V 120 ns (5.0 0.5 V), 130 ns (3.3 0.3 V), Block Locate Option T = Top Boot B = Bottom Boot Package N = 44-pin SOP (SOP044-P-0600) VALID OPERATIONAL COMBINATIONS = 2 ...

Page 40

SOP (SOP044-P-0600 0.4 0 0.1 0.15 M 1.27 TYP 0.2 28.2 PACKAGING 0.15 0.05 Package base plane ...

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