5962-9201001MXC Cypress Semiconductor Corp, 5962-9201001MXC Datasheet - Page 5

• Manufacturer Part Number: 5962-9201001MXC
• Manufacturer: Cypress Semiconductor Corp

Specifications of 5962-9201001MXC

• Lead Free Status / Rohs Status: Not Compliant

DSCC FORM 2234
herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A.
the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
microcircuit group number 105 (see MIL-PRF-38535, appendix A).
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be
in accordance with MIL-PRF-38535, appendix A.
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for
groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
APR 97
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
4.2.1 Additional criteria for device class M.
4.2.2 Additional criteria for device classes Q and V.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
a.
b.
a.
b.
c.
(1)
(2)
Burn-in test, method 1015 of MIL-STD-883.
Interim and final electrical test parameters shall be as specified in table II herein.
The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained
under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance
with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit
shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified
in test method 1015 of MIL-STD-883.
Interim and final electrical test parameters shall be as specified in table II herein.
Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
DEFENSE SUPPLY CENTER COLUMBUS
Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
test method 1015.
T
A
MICROCIRCUIT DRAWING
= +125 C, minimum.
COLUMBUS, OHIO 43216-5000
STANDARD
SIZE
A
REVISION LEVEL
B
SHEET
5962-92010
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