JS28F128P30T85 Micron Technology Inc, JS28F128P30T85 Datasheet - Page 51

• Manufacturer Part Number: JS28F128P30T85
• Manufacturer: Micron Technology Inc

Specifications of JS28F128P30T85

• Cell Type: NOR
• Density: 128Mb
• Access Time (max): 85/17ns
• Interface Type: Parallel/Serial
• Boot Type: Top
• Address Bus: 23b
• Operating Supply Voltage (typ): 1.8V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Program/erase Volt (typ): 1.7 to 2/8.5 to 9.5V
• Sync/async: Async/Sync
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 1.7V
• Operating Supply Voltage (max): 2V
• Word Size: 16b
• Number Of Words: 8M
• Supply Current: 28mA
• Mounting: Surface Mount
• Pin Count: 56
• Lead Free Status / Rohs Status: Compliant

P30
Figure 17: Reset Operation Waveforms
12.3
August 2008
Order Number: 306666-12
(A) Reset during
(B) Reset during
(C) Reset during
(D) VCC Power-up to
read mode
program or block erase
P1 ≤ P2
program or block erase
P1 ≥ P2
RST# high
Power Supply Decoupling
Flash memory devices require careful power supply de-coupling. Three basic power
supply current considerations are 1) standby current levels, 2) active current levels,
and 3) transient peaks produced when CE# and OE# are asserted and deasserted.
When the device is accessed, many internal conditions change. Circuits within the
device enable charge-pumps, and internal logic states change at high speed. All of
these internal activities produce transient signals. Transient current magnitudes depend
on the device outputs’ capacitive and inductive loading. Two-line control and correct
de-coupling capacitor selection suppress transient voltage peaks.
Because Numonyx Multi-Level Cell (MLC) flash memory devices draw their power from
VCC, VPP, and VCCQ, each power connection should have a 0.1 µF ceramic capacitor to
ground. High-frequency, inherently low-inductance capacitors should be placed as close
as possible to package leads.
Additionally, for every eight devices used in the system, a 4.7 µF electrolytic capacitor
should be placed between power and ground close to the devices. The bulk capacitor is
meant to overcome voltage droop caused by PCB trace inductance.
RST# [P]
RST# [P]
RST# [P]
V
CC
V
V
V
V
V
V
V
0V
CC
IH
IH
IH
IL
IL
IL
P1
P2
P2
P3
Complete
Abort
Complete
Abort
R5
R5
Datasheet
R5
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